Flexible dual-curing resin composition and preparation method of molded body thereof

Abstract

The invention relates to a flexible dual-curing resin composition and a preparation method of a molded body of the flexible dual-curing resin composition. A, a polyurethane prepolymer; b, a nitrogen-containing heterocyclic acrylic acid compound; c. A chain extender; wherein the molar ratio of the-NCO group contained in the polyurethane prepolymer a to the nitrogen-containing heterocyclic acrylic acid compound b is 0.98-1.02, and the molar ratio of the-NCO group contained in the polyurethane prepolymer a to the-OH group contained in the chain extender c is 0.98-1.02. The composition disclosed by the invention can be used for preparing a molded product with relatively high precision and complexity, and the molded product obtained after light and heat dual curing has the characteristics of good molding effect, flexibility and comprehensive performance.

Description

Technical field [0001] The present invention relates to a flexible dual cured resin composition, which belongs to the field of polymer materials, and more particularly to a flexible polyurethane composition that can be cured under light and thermal conditions. Background technique [0002] Light, thermally curing forming technology is an efficient, environmentally friendly, energy-saving quality material forming technology, including photocuring molding technology (STEREO LITHOGRAPHY APPARATUS, SLA or DIGITAL LIGHT Processing, DLP), Laminated Object Manufacturing, Lom ), Selective laser burning, SLS and Melt Deposition Molding, FDM, etc. By using ultraviolet light curing or thermal melt cooling curing, the rapid increase in material production techniques of three-dimensional entities are generated by layer by layer, but not only overcome the loss of traditional flushing materials, but also make product manufacturing more intelligent, precise Chemical and efficient. [0003] Curin...

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Problems solved by technology

[0003] Curing molding materials are the material basis of light and heat curing molding technology, but at present it is also a technical bottleneck that restricts the further development of this technology

For example, SLA or DLP technology generally uses free-radical polymerizable oligomers to add photoinitiators, which are quickly cured under ultraviolet light and built up layer by layer. However, traditional light-cured molding materials are brittle and have poor mechanical properties, which limits their The scope of application, if the amount of main resin is increased, the viscosity of the system will be too large to affect the molding accuracy; the molding materials used in FDM technology are usually thermoplastic polymer materials, including acrylonitrile-butadiene-styrene copolymer, polylactic acid, poly Carbonate, polyphenylsulfone, thermoplastic polyurethane, etc., but they have large thermal shrinkage, which affects the precision of the finished product, and the effect of the finished product is not stable enough; although SLS technology can produce more accurate models and prototypes, it can be used for laser sintering molding The materials are very limited, basically including rigid polymers such as nylon and polystyrene, and the products obtained by sintering are all rigid products with high hardness and poor flexibility

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