Motor controller using phase change material to absorb heat

Abstract

The invention discloses a motor controller utilizing a phase change material to absorb heat, which comprises a conductive mechanism, a gasket positioned below the conductive mechanism and a heat absorption mechanism positioned below the gasket and used for absorbing heat generated by the conductive mechanism, and is characterized in that the heat absorption mechanism comprises a shell mechanism and the phase change material positioned in the shell mechanism; the phase-change material generates phase change to absorb a large amount of heat, the arrangement of the phase-change material can absorb a large amount of heat, the problem of rapid temperature rise caused by large amount of heating of the MOS tube in a short time is solved, and the arrangement of the division bars can be used for heat conduction and transient heat absorption, and facilitates steady-state heat transfer at the same time.

Description

technical field [0001] The invention relates to the technical field of controllers, in particular to a motor controller using phase change materials to absorb heat. Background technique [0002] With the development of society and the advancement of science and technology, people's travel tools are gradually converted to cars. Then, due to the country's promotion of green energy in recent years, electric cars have gradually increased and will become the dominant position in cars. Electric cars are in the process of manufacturing , the motor controller, the core unit of electric vehicles, is now developing in the direction of high frequency, high power, high integration and miniaturization. , there will be a large energy loss during the working process, especially in the process of climbing the vehicle, because the power required by the vehicle is greatly increased, the MOS tube of the motor controller will generate a large amount of heat in a short time to make the temperatu...

AI Technical Summary

Problems solved by technology

This structure can meet certain heat dissipation requirements, but when the MOS tube generates a large amount of heat in a short period of time due to some reasons, the heat absorption capacity of the aluminum plate is insufficient, which may lead to a rapid rise in the temperature of the MOS, resulting in thermal failure or even burning of the electronic device.

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