Laser scribing device, scribing method of thin film photovoltaic chip and power generation building board

Abstract

The invention relates to the technical field of photovoltaics, and discloses laser scribing equipment, a scribing method of a thin film photovoltaic chip and a power generation building board. The light spot of the target light beam output by the laser scribing equipment is a rectangular light spot, and the light intensity distribution of the light spot of the target light beam in the length and width directions is flat-topped distribution, namely, the target light beam is a two-dimensional flat-topped light beam. Compared with a Gaussian beam used in the prior art, the light spot of the target beam has the characteristic of uniform light intensity distribution, so that the light transmission of the lineation generated by using the target beam for scribing is uniform in the width direction, and the problems of high light spot center energy density, large ablation amount, low edge energy density and low edge energy density in the prior art are solved. And the light transmission degree of the scribing edge is not uniform due to insufficient ablation. The thin film photovoltaic chip adopted by the power generation building board is manufactured through the laser scribing equipment or the scribing method, and good use experience can be provided for users.

Description

Technical field [0001] The present application relates to the field of photovoltaic techniques, and in particular, a laser scratching apparatus, a method of sculating a thin film photovoltaic chip, and a power generation building sheet. Background technique [0002] PV Building Integrated (BIPV) is a technique integrated into a building in a building. PV building integration is one of the most important fields in photovoltaic applications, and its development prospects are very broad and have huge market potential. The power generation building plate can be a roof, outer wall, or the like, such as a thin film photovoltaic chip, such as a cadmium diaphragm chip. In some scenarios, such as using a thin film photovoltaic chip to a glass window, a thin film photovoltaic chip requires a light transmittance to ensure indoor lighting. It is therefore necessary to scrapen the light absorbing layer (difficult to transparent) in the chip in the production of a thin film photovoltaic chip, ...

AI Technical Summary

Problems solved by technology

The existing method is to use a laser to ablate the light-absorbing layer to remove part of the material of the light-absorbing layer, but the existing scribing equipment and scribing methods have the problem of poor scribing effect, and the impact is that the thin-film photovoltaic chip And the use experience of power generation building panels is poor

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