A three-dimensional stacked high-power tr hermetically sealed package

Abstract

The invention provides a three-dimensional stacked high-power TR hermetically sealed package assembly, which includes a radio frequency TR chip layer, a power supply and switch drive layer, an energy storage capacitor layer and a cover plate stacked sequentially from bottom to top to form a hermetically sealed package structure; the radio frequency TR The chip layer, the power supply and switch driving layer, and the energy storage capacitor layer are all provided with solid vias penetrating each layer to realize the electrical connection between the upper and lower sides of each layer; the vertical interconnection structure is used to realize electrical interconnection between the layers; The lower side of the chip layer is provided with a radio frequency input link, a radio frequency output link, and a power supply and control signal input link; the upper side is provided with at least one radio frequency TR amplification link; the upper side of the power supply and switch driving layer is provided with a power supply modulation circuit and a radio frequency Switch driving chain; a number of energy storage capacitors are connected in parallel in the energy storage capacitor layer. The invention solves the problem of heat dissipation of the high-power TR chip, reduces the wiring distance of the pulse high-current control circuit, has higher integration, and has excellent air-tight performance, and can be adapted to large-scale automated assembly.

Description

technical field [0001] The invention relates to the fields of microwave and millimeter wave communication and phased array radar, in particular to a three-dimensional stacked high-power TR hermetic package assembly. Background technique [0002] In recent years, the development of microwave and millimeter-wave communication has been changing rapidly, especially in the field of phased array radar, under the general trend of increasing radar transmission frequency, narrower and narrower channel spacing of TR components, increasing transmission power and improving performance. The core of the phased array radar - the integration of high-power TR components must also keep pace with the times, adopt new technologies, new methods, and continuous iterative updates to meet the radar's high power, high heat dissipation, and high integration of high-power TR components. High performance requirements such as degree and air tightness. [0003] At present, the mainstream high-power TR p...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the problems existing in the prior art, a three-dimensional stacked high-power TR hermetic packaging assembly is provided, which simultaneously solves the heat dissipation problem of high-power TR chips, reduces the distance of pulse and high-current control lines, and has higher integration and air-tightness. Excellent airtight performance, can adapt to large-scale automatic assembly

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