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Method for preparing tungsten dispersion strengthened copper composite material through electroforming

A technology for dispersion-strengthening copper and composite materials, applied in electroforming, electrolytic processes, etc., can solve the problems of tungsten dispersion-strengthened copper composite materials without electroforming method, and tungsten dispersion-strengthened copper composite materials without electroplating, and achieve fine particle size. , uniform distribution, uniform and fine distribution

Active Publication Date: 2022-04-08
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Currently, the patent CN201010575369.7 and existing documents disclose the method of preparing pure copper coating or pure tungsten coating by electroplating method, but there is no report on electroplating tungsten dispersion strengthened copper composite material, and there is no electroforming method to prepare tungsten dispersion Relevant reports on reinforced copper composite materials

Method used

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  • Method for preparing tungsten dispersion strengthened copper composite material through electroforming
  • Method for preparing tungsten dispersion strengthened copper composite material through electroforming
  • Method for preparing tungsten dispersion strengthened copper composite material through electroforming

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] 1. Weigh copper nitrate and sodium tungstate according to the mass ratio of copper to tungsten of 100:1, and add sodium citrate with a content of 1g / L and sodium lauryl sulfate with a content of 0.1g / L. Dissolve in deionized water and stir until completely mixed.

[0031] 2. The cathode copper plate is degreased, pickled and cleaned with deionized water until the surface is clean.

[0032] 3. Add the anode, cathode and the prepared plating solution into the electroplating tank, the DC power supply voltage is 5V, and the cathode current density is controlled to be 1A / dm 2 , the electroforming temperature is 40°C, the pH value is controlled at 8, and the electroforming time is 12h.

[0033] 4. Cleaning and drying after the electroforming is completed, and then demoulding the electroformed components to obtain a tungsten dispersion-strengthened copper composite sheet with a thickness of 0.5 mm.

[0034] In this embodiment, the tensile strength of the tungsten dispersion ...

Embodiment 2

[0036] 1. Weigh copper sulfate and ammonium metatungstate according to the mass ratio of copper to tungsten of 10:1, add sodium citrate with a content of 5g / L, and sodium lauryl sulfate with a content of 0.5g / L. Dissolve in deionized water and stir until completely mixed.

[0037] 2. The cathode copper plate is degreased, pickled and cleaned with deionized water until the surface is clean.

[0038] 3. Add the anode, cathode and the prepared plating solution into the electroplating tank, the DC power supply voltage is 8V, and the cathode current density is controlled to be 3A / dm 2 , the electroforming temperature is 70°C, the pH value is controlled at 10, and the electroforming time is 24h.

[0039] 4. Cleaning and drying after the electroforming is completed, and then demoulding the electroformed components to obtain a tungsten dispersion-strengthened copper composite sheet with a thickness of 0.75 mm.

[0040] In this embodiment, the tensile strength of the tungsten dispers...

Embodiment 3

[0042] 1. Weigh copper chloride and sodium metatungstate according to the copper:tungsten mass ratio of 5:1, add sodium citrate with a content of 10g / L, and sodium lauryl sulfate with a content of 1g / L. Dissolve in deionized water and stir until completely mixed.

[0043] 2. The cathode copper plate is degreased, pickled and cleaned with deionized water until the surface is clean.

[0044]3. Add the anode, cathode and the prepared plating solution into the electroplating tank, the DC power supply voltage is 10V, and the cathode current density is controlled to be 5A / dm 2 , the electroforming temperature is 80°C, the pH value is controlled at 10, and the electroforming time is 48h.

[0045] 4. Clean and dry after electroforming, and then remove the electroformed components to obtain a tungsten dispersion-strengthened copper composite sheet with a thickness of 1.2 mm.

[0046] In this embodiment, the tensile strength of the tungsten dispersion strengthened copper composite mat...

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Abstract

The invention provides a method for preparing a tungsten dispersion strengthened copper composite material through electroforming, and belongs to the field of copper-based composite material preparation. The process comprises the following steps: preparing a plating solution containing copper and tungsten, treating an electrode plate, then adjusting proper electroforming process parameters, depositing ions containing copper and tungsten on a cathode plate subjected to specific treatment, and finally separating a casting layer to obtain the block copper-tungsten composite material with uniformly distributed tungsten particles and small size. The composition proportion, microstructure, mechanical properties and the like of the composite material can be controlled by adjusting electroforming parameters and plating solution components. The preparation method has the characteristics of short preparation process, continuous and controllable components and fine and uniform particles, the nano tungsten particles can greatly improve the mechanical property of the copper alloy, excellent electric and heat conduction performance is kept, and the preparation method has wide prospects in application of electronic packaging materials, electrode materials, electric contact materials and the like.

Description

technical field [0001] The invention belongs to the technical field of preparation of copper-based composite materials. It relates to a method for preparing tungsten dispersion strengthened copper composite material by electroforming. [0002] technical background [0003] Copper is one of the earliest metals developed and utilized by humans. Copper alloy has the advantages of good electrical and thermal conductivity and good processability, so it has been widely used in the fields of electric power, transportation, and energy. With the advancement of science and technology, the demand for new copper-based composite materials is increasing, and the requirements for its comprehensive performance are becoming increasingly stringent. Traditional pure copper and solid-solution strengthened copper alloys are difficult to balance both strength and electrical and thermal conductivity. Particle-reinforced copper-based composites have the characteristics of high strength, good high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/00
Inventor 陈存广张陈增李学成李杨杨芳郭志猛孙春芳祁妙
Owner UNIV OF SCI & TECH BEIJING
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