Double-sided polishing device and double-sided polishing method

Abstract

The invention relates to a double-sided grinding device, which is used for grinding two opposite surfaces of a silicon wafer, and comprises an annular bearing structure, a grinding device and a grinding device, and is characterized in that the annular bearing structure is used for supporting the silicon wafer from the peripheral side in the radial direction; the two static pressure supporting pieces are oppositely arranged, are respectively positioned on two sides of the silicon wafer, and are used for supporting the silicon wafer in a non-contact manner through fluid static pressure; the two grinding wheels are oppositely arranged and used for grinding the two opposite faces of the silicon wafer, the two static pressure supporting pieces comprise the first static pressure supporting piece and the second static pressure supporting piece, and the first static pressure supporting piece is used for adsorbing the ground silicon wafer; and the cleaning structure is used for cleaning the first static pressure supporting piece. The invention further relates to a double-sided grinding method. Through the arrangement of the cleaning structure, the static pressure supporting piece used for adsorbing the silicon wafer is cleaned, and the smoothness of the wafer is prevented from being influenced.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a double-side grinding device and a double-side grinding method. Background technique [0002] The processing technology of silicon wafers is developing rapidly, and double-sided grinding technology is developing day by day. As the diameter of silicon wafers becomes larger and the feature size of integrated circuits becomes smaller and smaller, the flatness of the wafer surface, the degree of cleanliness of the surface, and the degree of damage are raised. higher requirement. [0003] DDSG (Double Disk Surface Grinding) is used. The grinding method includes: placing the wafer vertically on the ring carrier and between two opposite static pressure supports. The wafer is balanced by hydrostatic pressure and connected to the ring. The carrier rotates together at a low speed, while two grinding wheels facing each other rotate at a high speed to grind both surfaces of the wafe...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above-mentioned technical problems, the present invention provides a double-sided grinding device and a double-sided grinding method to solve the problem caused by the pollution on the static pressure support to the surface of the wafer. Dimple-like defect problem

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