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MEMS gyroscope performance pre-evaluation on-chip test system

A test system and pre-evaluation technology, which is applied in the field of MEMS gyro test, can solve the problems of cumbersome operation steps and inability to obtain real-time data, achieve accurate test results, simplify test equipment and processes, and shorten test time

Pending Publication Date: 2022-03-29
NANJING UNIV OF SCI & TECH
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  • Claims
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AI Technical Summary

Problems solved by technology

This type of method usually requires a lot of equipment, the operation steps are cumbersome, the data needs to be processed offline, and real-time data cannot be obtained.

Method used

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  • MEMS gyroscope performance pre-evaluation on-chip test system
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  • MEMS gyroscope performance pre-evaluation on-chip test system

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Embodiment Construction

[0021] The present invention will be further introduced below in conjunction with the accompanying drawings and specific embodiments.

[0022] combine figure 1 , a MEMS gyro performance pre-evaluation on-chip test system, including a wafer test probe circuit, a data acquisition card and a host computer data acquisition system;

[0023] The wafer test probing circuit connects the drive electrode, detection electrode, and drive detection electrode of the wafer-level MEMS gyroscope through the probe, and uses the mode control module to switch the wafer-level MEMS gyroscope loop closed loop or detection loop closed loop, and realize the drive detection signal The read-out of VDS, detection signal VS, gain control level PI; The test port of described data acquisition card connection disc test probe circuit, output mode control level under the control of upper computer data acquisition program, and the gyroscope The output signal is transmitted to the host computer; the data acquis...

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Abstract

The invention discloses an MEMS gyroscope performance pre-evaluation on-chip test system. The test system comprises a wafer test probe card circuit, a data acquisition card and an upper computer data acquisition system. And the upper computer data acquisition system controls the data acquisition card to output a mode control level so as to switch the closed loop of the driving loop or the closed loop of the detection loop of the wafer-level MEMS gyroscope. When the driving loop is closed, a driving detection signal, a detection signal and a gain control level are acquired, and phase-sensitive demodulation, coupling error and driving quality factor calculation are carried out in an upper computer data acquisition system; when the detection loop is closed, a detection signal and a gain control level are collected, and calculation of a detection quality factor is completed in an upper computer program. According to the invention, the coupling error test is carried out on the wafer level MEMS gyroscope by adopting an electrical measurement mode, so that the separation of a structure error source is facilitated, and a basis is provided for the performance pre-evaluation of the wafer level MEMS gyroscope; and a closed-loop test scheme of the gyroscope detection quality factor is provided, so that the test steps are simplified, and the test efficiency is improved.

Description

technical field [0001] The invention belongs to the field of MEMS gyroscope testing, in particular to an on-chip test system for MEMS gyroscope performance pre-evaluation. Background technique [0002] Silicon micromachined gyroscope is an angular velocity sensor device based on the Coriolis effect and based on MEMS processing technology. It has outstanding advantages such as small size, light weight, low power consumption, low cost, and easy mass production. It is widely used in micro-inertial navigation system, automobile safety, industrial automatic control, consumer electronics and other fields, and has broad development prospects. [0003] The coupling error of the MEMS gyroscope is an important part of its zero bias, which mainly comes from the process errors in the production and processing processes such as etching, bonding, and packaging. The coupling error is divided into in-phase coupling error and quadrature coupling error. The in-phase coupling error is in phas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01C25/00
CPCG01C25/005
Inventor 赵阳赵倩楠施芹夏国明裘安萍
Owner NANJING UNIV OF SCI & TECH
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