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Method and device for detecting water vapor intrusion path of packaged device

A packaging device and path detection technology, which is applied in the direction of measuring devices, instruments, scientific instruments, etc., can solve the problems of poor moisture-proof reliability of products, and the inability to obtain the path and speed of water vapor intrusion, so as to improve the moisture-proof reliability and dynamic detection accuracy , Monitoring the effect of product life

Active Publication Date: 2022-05-20
胜科纳米(苏州)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing problem is that the water absorption rate of the device can only be calculated by the weighing method, and the path and speed of water vapor intrusion in the sample cannot be obtained, which cannot fundamentally solve the problem of poor moisture-proof reliability of the product
The problem is that the water vapor permeation analysis method is only suitable for thin film, sheet or plate samples, and there are specific requirements for the shape of the sample to be tested, and this method can only obtain the water vapor transmission rate of water vapor in the sample to be tested. , the path and speed of water vapor intrusion in the sample cannot be obtained, and the problem of poor moisture-proof reliability of the product cannot be fundamentally solved

Method used

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  • Method and device for detecting water vapor intrusion path of packaged device
  • Method and device for detecting water vapor intrusion path of packaged device
  • Method and device for detecting water vapor intrusion path of packaged device

Examples

Experimental program
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Embodiment 1

[0031] figure 1 It is a flow chart of a method for detecting water vapor intrusion path of a packaged device provided in Embodiment 1 of the present invention. This embodiment is applicable to the application scenario of dynamically detecting the path and speed of water vapor intrusion of a packaged device. The method can be implemented by a detection device To execute, the detection device may be implemented in the form of hardware and / or software, and the detection device may be configured in one or more detection devices and / or control modules.

[0032] Such as figure 1 As shown, the method for detecting the water vapor intrusion path of the packaged device specifically includes the following steps:

[0033] Step S1: Carry out water vapor trace marking on the packaged device to be tested based on the preset tracer, and obtain trace mark samples.

[0034] Among them, the packaged device to be tested can be a display screen, a display application film, a plastic packaged de...

Embodiment 2

[0077] Optionally, Figure 7The flow chart of a method for detecting water vapor intrusion paths of packaged devices provided by Embodiment 2 of the present invention. Compared with Embodiment 1, Embodiment 2 of the present invention improves the detection by coating the tested samples analyzed by secondary ion mass spectrometry. accuracy.

[0078] Such as Figure 7 As shown, before performing secondary ion mass spectrometry analysis on the tracer-labeled sample, the detection method also includes: performing surface conductive film coating treatment on the tracer-labeled sample. The method for detecting the water vapor intrusion path of the packaged device specifically includes the following steps:

[0079] Step S1: Carry out water vapor trace marking on the packaged device to be tested based on the preset tracer, and obtain trace mark samples.

[0080] Step S4: Coating the surface of the tracer-marked sample with a conductive thin film, and using the coated sample as a sa...

Embodiment 3

[0085] Figure 8 It is a schematic structural diagram of a water vapor intrusion path detection device for a packaged device provided in Embodiment 3 of the present invention. The detection device in this embodiment is used to execute the water vapor intrusion path detection method for a packaged device provided in any one of the above embodiments, and has the corresponding implementation methods. functional modules and beneficial effects.

[0086] Such as Figure 8 As shown, the detection device 00 includes: a labeling module 101 , a mass spectrometry analysis module 102 and a data processing module 103 . Among them, the labeling module 101 is used to carry out water vapor trace labeling on the packaged device to be tested based on the preset tracer, and obtain tracer marked samples; The tracer intensity of the marked sample; the data processing module 103 is used to determine the path and speed of water vapor intrusion according to the tracer intensity.

[0087] Optionall...

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Abstract

The invention discloses a method and device for detecting the water vapor intrusion path of a packaging device. The method includes: performing water vapor trace marking on the packaged device to be tested based on a preset tracer, and obtaining a trace mark sample; performing a trace mark on the trace mark sample. Secondary ion mass spectrometry, to obtain the tracer intensity of the tracer-labeled sample; determine the path and speed of water vapor intrusion according to the tracer intensity. The invention combines the preset tracer with the secondary ion mass spectrometer to detect the water vapor intrusion path and speed of the packaged device, which is beneficial to improving the dynamic detection accuracy of water vapor intrusion and fundamentally improving the moisture-proof reliability of the packaged device.

Description

technical field [0001] The invention relates to the technical field of semiconductor performance detection, in particular to a method and device for detecting water vapor intrusion paths of packaged devices. Background technique [0002] Electronic packaging refers to the process of connecting and fixing the package body with the substrate or frame to form a complete system or electronic equipment. Epoxy resin (EMC) is the most widely used electronic packaging material. Epoxy resin packaging is a non-hermetic package. Water vapor can invade the chip along the packaging material, plastic packaging compound, interface or substrate of the structural frame, etc. , resulting in chip corrosion and short circuit failures. Therefore, packaging performance testing of packaged devices is required. [0003] In the prior art, for packaging performance testing of packaged devices, the following two methods are mainly adopted: [0004] The first method is the weighing method. The weig...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N27/62G01N15/08
CPCG01N27/62G01N15/08G01N2015/0813
Inventor 廖金枝朱雷张兮乔明胜华佑南李晓旻
Owner 胜科纳米(苏州)股份有限公司
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