Metal ceramic tube shell package for low-frequency high-power device

Abstract

The invention provides a metal ceramic tube shell package for a low-frequency high-power device. The metal ceramic tube shell package comprises a quasi-rectangular metal heat sink, a ceramic package body and a power device, the two ends of the metal heat sink are respectively provided with a connecting part, and a thermal phase change material layer is embedded between the two connecting parts; a first heat dissipation part is arranged on the bottom wall of the ceramic packaging body, and the first heat dissipation part corresponds to the phase change material layer in position; the power device is attached to the inner bottom wall of the ceramic packaging body and located over the first heat dissipation part. Wherein the first heat dissipation part is used for conducting heat dissipated by the power device to the thermal phase change material layer, and then the heat is transferred to the metal heat sink for heat exchange with the outside; the metal heat sink is provided with a stress slow-release part in a region between the ceramic packaging body and the two connecting parts. According to the low-frequency high-power device metal ceramic tube shell package provided by the invention, the long-term use reliability of the power device can be improved in two aspects of overcoming the mechanical stress problem and the heat dissipation problem.

Description

technical field [0001] The invention belongs to the technical field of tube and shell packaging, and in particular relates to a metal ceramic tube and shell package for low-frequency and high-power devices. Background technique [0002] With the development of microwave power devices towards high power, the power chips used in the devices are getting larger and larger, so the aspect ratio of the package shell is also increasing, which leads to the stress problem of power devices in engineering applications getting more serious. At present, the aspect ratio of package tubes used in high-power devices is close to four to one. At the same time, because the adhesive fixing method cannot meet the long-term use requirements, in order to ensure long-term sealing performance, most power device packages are fixed by brazing. However, due to the poor ductility of the solder, when fixing the package case in practical engineering applications, due to the pulling of the fastening stress...

AI Technical Summary

Problems solved by technology

At present, the aspect ratio of package tubes used in high-power devices is close to four to one. At the same time, since the method of adhesive fixing cannot meet the long-term use requirements, in order to ensure long-term sealing performance, most power device packages are fixed by brazing. However, due to the poor ductility of the solder, when fixing the package case in practical engineering applications, due to the pulling of the fastening stress, it is easy to cause the ceramic body of the package case to crack, and in severe cases, it may even cause damage to the power chip and burn it. In addition, due to the high calorific value of high-power devices, the heat dissipation effect of relying solely on the package shell itself to dissipate heat toward the outside is poor, which is also a factor that causes power chips to overheat and burn out and affect their long-term reliability.

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