Semiconductor enhanced refrigeration device and connecting and fixing method thereof

Abstract

The invention relates to a semiconductor enhanced refrigeration device. The device comprises an aluminum alloy fin, a semiconductor refrigeration sheet and two aluminum alloy supports connected together. The interior of the aluminum alloy support is an arc surface, the exterior of the aluminum alloy support is three planes, and each plane is provided with a boss and two threaded holes. The bosses are attached to the inner surface of the semiconductor refrigeration sheet, and the outer surface of the semiconductor refrigeration sheet is attached to the aluminum alloy fin. The center line of the aluminum alloy fin is provided with two counter bores, and the counter bores correspond to the threaded holes. Heat preservation cotton is arranged between the aluminum alloy fin and the aluminum alloy supports. The device is convenient to install and maintain, good in durability, high in heat transfer efficiency, simple and reliable in connecting and fixing method, high in practicability and suitable for special environment working conditions of permafrost regions.

Description

technical field [0001] The invention relates to the technical field of permafrost protection, in particular to a semiconductor enhanced refrigeration device and a connection and fixing method thereof. Background technique [0002] The Qinghai-Tibet Plateau has built major infrastructure projects such as the Qinghai-Tibet Highway, the Qinghai-Tibet Railway, and the Qinghai-Tibet DC Connection. These projects have passed through the permafrost region of the Qinghai-Tibet Plateau. The temperature of permafrost is an important factor affecting the stability of engineering operations in permafrost regions. As a cooling measure, heat pipes are widely used to slow down the temperature rise of engineering foundations in permafrost regions. However, the working hours of heat pipes have obvious periodicity. They work in cold seasons and do not work in warm seasons. Ground heating is limited. In order to solve this problem, based on the working principle of the heat pipe, an external...

AI Technical Summary

Problems solved by technology

The surface of the semiconductor cooling chip is flat, while the outer surface of the heat pipe is arc-shaped, and the two surfaces cannot be directly and completely bonded.

For this problem, the existing solution is to fix some semiconductive refrigeration chips on one side of a planar metal plate, and the other side is in contact with the surface of the heat pipe, but the surface of the metal plate and the surface of the heat pipe still cannot be completely bonded, resulting in the failure of semiconductive refrigeration. The heat transfer efficiency between the sheet and the heat pipe is low, and the cooling capacity of the semiconductor cooling sheet cannot be fully utilized

In addition, the existing equipment installation process is complicated and difficult to maintain

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