Chip on film, GOA driving method and display device

Abstract

The invention discloses a chip on film, a GOA driving method and a display device. The chip on film comprises a plurality of pins arranged in an array, wherein the pins comprise signal terminals and redundant terminals; a plurality of adjacent pins form a first pin area; the signal terminals in the first pin area are double-pin signals; the adjacent pins in the double-pin signals correspond to the same signal; and the redundant terminals are arranged on two sides of the first pin area. According to the chip on film provided by the embodiment of the invention, by optimizing an arrangement mode of the pins, metal corrosion of a binding area is reduced, voltage differences between the pins are reduced, and duration of high voltage differences is shortened; a time sequence of driving signals is optimized, so that the optimization effect is further improved, and badness caused by the metal corrosion is avoided; and under the condition that a charging rate is not influenced, the problem of abnormal display of a high-frequency product under high-temperature and high-humidity reliability is solved, and the reliability of the product is improved.

Description

technical field [0001] The present application generally relates to the field of display technology, and specifically relates to a chip-on-chip film, a GOA driving method, and a display device. Background technique [0002] In recent years, in order to pursue more stable images, smoother dynamic image performance, and better gaming experience of display products, the market share of high refresh rate mobile phone products has gradually increased. However, a high frame rate means that the display time of each frame is reduced. When the resolution remains unchanged, the charging time of the pixel is reduced accordingly. When the frame rate is high, there may be a problem of insufficient charging time. In order to solve the problem of insufficient charging of the pixel, the driving voltage of the product will be increased to speed up the charging speed of the pixel. [0003] However, when the driving voltage increases, the metal Ni ions in the ACF conductive adhesive in the Bo...

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Problems solved by technology

[0003] However, when the driving voltage increases, the metal Ni ions in the ACF conductive adhesive in the Bonding pin where the COF Bonding position is at a high potential are prone to electrochemical corrosion in a high-temperature and high-humidity (85°C, 85% R.H.) environment Ni-2e=Ni ^2+, resulting in the lack of Ni plating. Due to the small area of ​​the COF bonding pin, the commonly used pin width is 12um, the gap is 18um, and the length is only 0.4mm. The number of conductive particles is limited, and the product will fail under long-term action.

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