Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat dissipation device

A heat dissipation device and heat pipe technology, applied in the direction of indirect heat exchangers, heat exchange equipment, lighting and heating equipment, etc., can solve the problems of limited effect, inability to dissipate high heat, poor heat dissipation efficiency, etc., to increase chaos and improve The effect of contact opportunity and improvement of heat dissipation efficiency

Pending Publication Date: 2022-01-21
AURAS ELECTRONICS SCI & TECH IND KUNSHAN
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the effect of this heat dissipation method is limited, so a heat dissipation element that uses the phase change of the working fluid to promote heat conduction has been developed.
[0003] The above-mentioned cooling elements achieve the purpose of transferring heat through the phase change and flow direction of the working fluid, but when faced with the high heat generated by high-power processors, It still cannot effectively dissipate high heat, but has the problem of poor heat dissipation efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipation device
  • Heat dissipation device
  • Heat dissipation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0057] The implementation of the present invention is described below through specific specific examples, and those who are familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this description, and can also be implemented through other different specific examples or apply.

[0058] Please also see figure 1 , figure 2 and image 3 , The heat dissipation device 1 of the present invention includes a vapor chamber unit 10 , a heat pipe set 11 , a first fin set 21 and a second fin set 22 . The heat pipe group 11 is arranged on the outer surface 1011 of the chamber unit 10, the first fin group 21 is arranged on the outer surface 1011 of the chamber unit 10 and the heat pipe group 11 is sleeved, and the heat pipe group 11 is partially exposed, and the second The two fin sets 22 are stacked on the first fin set 21 and cover the exposed portion of the heat pipe set 11 by the first fin set 21 , and c...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a heat dissipation device. The heat dissipation device comprises a vapor chamber unit, a heat pipe set, a first fin set and a second fin set. The heat pipe group is arranged on the outer surface of the vapor chamber unit; the first fin group is arranged on the outer surface of the vapor chamber unit and sleeves the heat pipe group; the second fin group is stacked on the first fin group and sleeves the heat pipe group; wherein the fin arrangement direction of the first fin group is different from the fin arrangement direction of the second fin group.

Description

technical field [0001] The invention relates to the field of heat dissipation, in particular to a heat dissipation device with a uniform temperature plate and a fin group. Background technique [0002] According to modern requirements, computers and various electronic devices are developing rapidly and their performance is constantly improving. However, in the process, heat dissipation problems caused by high-performance hardware also follow. Generally speaking, computers and various electronic devices usually use heat dissipation components to dissipate heat. For example, heat dissipation paste or heat sinks are attached to the electronic components to be dissipated, so as to absorb and dissipate heat. However, the effect of this heat dissipation method is limited, so a heat dissipation element using phase change of the working fluid to promote heat conduction has been developed. [0003] The above-mentioned heat dissipation element achieves the purpose of heat transfer th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2039H05K7/20336H05K7/20327H05K7/20309F28D15/0275F28D15/0283F28D15/04F28D15/046F28F1/32F28D15/0233H05K7/202F28F1/22F28F1/325
Inventor 陈志伟张正儒黄俊玮
Owner AURAS ELECTRONICS SCI & TECH IND KUNSHAN
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com