Floor connecting structural adhesive and preparation method thereof

A technology for structural adhesives and floors, applied in the field of structural adhesives, can solve the problems of poor connection stability of structural adhesives, low waterproof and mildew resistance, etc., and achieve the effects of improving structural strength and toughness, strong mildew resistance, and avoiding damage

Pending Publication Date: 2021-12-24
HEMEI (ZHEJIANG) AUTOMOBILE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a floor joint structural adhesive and a preparation method thereof, which has the advantages of strong structure, environmental protection, waterproof, and mildew resistance, and solves the problem of poor connection stability of existing structural adhesives, poor waterproof and mildew resistance. low problem

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Embodiment 1: A floor joint structural adhesive, including the following raw materials: MDI, N330, polyether glycol, hydroxyl polybutadiene acrylonitrile, inorganic filler, thixotropic agent, coupling agent, antifungal agent and accelerator .

[0023] It should be noted that the mass ratio of MDI to polyether diol is 1:1, N330 is a high wear-resistant furnace black, the molecular weight of polyether diol is 1000, inorganic filler, thixotropic agent, hydroxyl polybutylene diol The mass ratio of acrylonitrile, coupling agent, antifungal agent and accelerator is 80:2:8:5:3:2.

[0024] In this embodiment, the thixotropic agent is organic bentonite, the coupling agent is a silane coupling agent, the inorganic filler is heavy calcium carbonate, and the accelerator is cobalt naphthenate.

[0025] A preparation method of floor joint structural glue, comprising the following steps:

[0026] 1) First weigh MDI, N330, polyether diol, hydroxypolybutadiene acrylonitrile, inorganic...

Embodiment 2

[0029] Embodiment 2: A floor joint structural adhesive, including the following raw materials: MDI, N330, polyether glycol, hydroxyl polybutadiene acrylonitrile, inorganic filler, thixotropic agent, coupling agent, antifungal agent and accelerator .

[0030] It should be noted that the mass ratio of MDI to polyether diol is 1:0.5, N330 is a high wear-resistant furnace black, the molecular weight of polyether diol is 1000, inorganic filler, thixotropic agent, hydroxyl polybutylene diol The mass ratio of acrylonitrile, coupling agent, antifungal agent and accelerator is 70:3:8:6:4:3.

[0031] In this embodiment, the thixotropic agent is a mixture of organic bentonite and fumed silica, the coupling agent is a silane coupling agent, the inorganic filler is heavy calcium carbonate, and the accelerator is a mixture of cobalt naphthenate and cobalt isooctanoate .

[0032] A preparation method of floor joint structural glue, comprising the following steps:

[0033] 1) First weigh M...

Embodiment 3

[0036] Embodiment 3: A floor joint structural adhesive, including the following raw materials: MDI, N330, polyether glycol, hydroxyl polybutadiene acrylonitrile, inorganic filler, thixotropic agent, coupling agent, antifungal agent and accelerator .

[0037] It should be noted that the mass ratio of MDI to polyether diol is 1:1.5, N330 is a high wear-resistant furnace black, the molecular weight of polyether diol is 1000, inorganic filler, thixotropic agent, hydroxyl polybutylene diol The mass ratio of acrylonitrile, coupling agent, antifungal agent and accelerator is 50:3:8:3:2:2.

[0038] In this embodiment, the thixotropic agent is castor oil, the coupling agent is a silane coupling agent, the inorganic filler is heavy calcium carbonate, and the accelerator is a mixture of cobalt isooctanoate and N,N-dimethyl-p-toluidine.

[0039] A preparation method of floor joint structural glue, comprising the following steps:

[0040] 1) First weigh MDI, N330, polyether diol, hydroxy...

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PUM

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Abstract

The invention relates to a floor connecting structural adhesive, which is prepared from the following raw materials: MDI, N330, polyether glycol and hydroxyl polybutadiene acrylonitrile, and the floor connecting structural adhesive also contains inorganic filler, a thixotropic agent, a coupling agent, a mildew preventive and an accelerant. According to the floor connecting structural adhesive and the preparation method thereof, the mildew preventive is added into the structural adhesive in the process of preparing the structural adhesive, so that the finished structural adhesive is higher in mildew resistance and is not easily influenced by a humid environment, and the structure of the structural adhesive is not damaged by mildew due to the fact that the mildew does not breed; the waterproof performance and the structural strength of the structural adhesive can be kept stable after the structural adhesive is used for a long time. By adding hydroxyl polybutadiene acrylonitrile and MDI in the preparation process, the toughness of the structural adhesive can be improved, so that the structural adhesive is prevented from being damaged by thermal expansion and cold contraction at the ground joint. Through the synergistic effect of the polyether glycol and the thixotropic agent, the structural strength and toughness can be further improved.

Description

technical field [0001] The invention relates to the technical field of structural adhesives, in particular to a floor joint structural adhesive and a preparation method thereof. Background technique [0002] Structural adhesives refer to adhesives that have high strength, can withstand large loads, are resistant to aging, fatigue, and corrosion, and have stable performance within the expected life. They are suitable for bonding structural parts that withstand strong forces. Structural adhesives are widely used in engineering. It is mainly used for reinforcement, anchorage, bonding and repair of components. [0003] The floor, that is, the surface layer of the ground or floor of the house, is made of wood or other materials. In the process of laying the floor in the house, in order to ensure the firmness of the floor connection, structural glue is often applied at the joint position. [0004] Due to the harsh environment of the floor, it is often affected by water immersion....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C09J11/04C09J11/08C08G18/48C08G18/69C08G18/76
CPCC09J175/14C09J11/04C09J11/08C08G18/698C08G18/4825C08G18/7671C08G2170/00C08K3/04C08K3/346C08K7/26C08L91/00
Inventor 陈阔崔臻张伟陶广华刘汉平
Owner HEMEI (ZHEJIANG) AUTOMOBILE CO LTD
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