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Copper immersion method and device for tungsten sponge matrix

A tungsten sponge and substrate technology, applied in the field of microwave vacuum electronic devices, can solve the problems affecting cathode emission performance, evaporation performance and cathode life, and achieve the effects of improving emission performance, inhibiting evaporation, and reducing holes

Active Publication Date: 2021-12-14
AEROSPACE INFORMATION RES INST CAS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using such a tungsten sponge matrix to prepare the cathode will affect the parameters such as the emission performance, evaporation performance and lifetime of the cathode.

Method used

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  • Copper immersion method and device for tungsten sponge matrix
  • Copper immersion method and device for tungsten sponge matrix
  • Copper immersion method and device for tungsten sponge matrix

Examples

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Embodiment 1

[0076] A tungsten sponge copper immersion method, the method for example comprises the following steps:

[0077] In step A, the oxygen-free copper 3 is put into the crucible 7 , and the tungsten sponge substrate 6 is suspended on the vacuum cover 4 .

[0078] Step B, use the high vacuum pump unit 8 to evacuate the vacuum chamber 1 to 5×10 Pa or below.

[0079] Step C, fill nitrogen, hydrogen or other inert gases that do not react chemically with oxygen-free copper and tungsten, keep the vacuum between 1Pa and 1000Pa, and heat the tungsten sponge substrate 6 and crucible 7 to 1550 through the heating body 2 ℃, so that the oxygen-free copper in the crucible is heated and melted, and the tungsten sponge matrix 6 is immersed in the oxygen-free copper liquid in the crucible 7 by the lifting mechanism 5, and kept warm for 5 hours, so that the copper is immersed in the tungsten sponge matrix.

[0080] In step D, the tungsten sponge substrate dipped in oxygen-free copper is lifted aw...

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Abstract

The invention provides a copper immersion method and device for a tungsten sponge matrix. The method comprises the steps that a copper immersion device is evacuated to a first vacuum degree, and air is discharged; inert gas is filled, and the vacuum degree is kept at a second vacuum degree; and oxygen-free copper is heated and melted, and the tungsten sponge matrix is immersed in liquid copper for the time T and then taken out, wherein the inert gas does not chemically react with the oxygen-free copper and the tungsten, the second vacuum degree is greater than the first vacuum degree, and the liquid copper is not evaporated under the second vacuum degree. According to the method, the copper immersion device is evacuated firstly, air in pores of the tungsten sponge matrix can be discharged, then a proper amount of hydrogen is introduced into the copper immersion device, the interior of the copper immersion device is in a low-vacuum state, evaporation of molten copper is inhibited, and finally, the copper liquid can be evenly immersed into the tungsten sponge matrix, so that holes appearing in the turning process of a cathode matrix due to the fact that the tungsten sponge matrix is difficult to immerse are greatly reduced, and the performance of a prepared cathode is improved.

Description

technical field [0001] The disclosure relates to the technical field of microwave vacuum electronic devices, in particular to a method and device for immersing copper in a tungsten sponge matrix. Background technique [0002] Microwave vacuum electronic devices are widely used in radar, satellite communications, electron accelerators, global positioning, controllable thermonuclear fusion and high-power microwave weapons at the frontier of the military in the future. In the case of high frequency band, it cannot be replaced by other devices. The cathode responsible for electron emission is the core part of microwave vacuum electronic devices. Its performance will directly affect the output performance and life of the microwave source, and then affect the performance and life of satellites and high-power microwave devices. An important indicator of electronic devices, to study the performance of cathode substrates, emissive materials, and cathode coatings, first of all, a con...

Claims

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Application Information

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IPC IPC(8): C22C1/10C22C1/02C22C9/00C22C27/04B22D23/04
CPCC22C1/1036C22C27/04C22C9/00B22D23/04
Inventor 刘燕文田宏李芬朱虹王国建赵恒邦王小霞
Owner AEROSPACE INFORMATION RES INST CAS
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