Copper immersion method and device for tungsten sponge matrix
A tungsten sponge and substrate technology, applied in the field of microwave vacuum electronic devices, can solve the problems affecting cathode emission performance, evaporation performance and cathode life, and achieve the effects of improving emission performance, inhibiting evaporation, and reducing holes
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[0076] A tungsten sponge copper immersion method, the method for example comprises the following steps:
[0077] In step A, the oxygen-free copper 3 is put into the crucible 7 , and the tungsten sponge substrate 6 is suspended on the vacuum cover 4 .
[0078] Step B, use the high vacuum pump unit 8 to evacuate the vacuum chamber 1 to 5×10 Pa or below.
[0079] Step C, fill nitrogen, hydrogen or other inert gases that do not react chemically with oxygen-free copper and tungsten, keep the vacuum between 1Pa and 1000Pa, and heat the tungsten sponge substrate 6 and crucible 7 to 1550 through the heating body 2 ℃, so that the oxygen-free copper in the crucible is heated and melted, and the tungsten sponge matrix 6 is immersed in the oxygen-free copper liquid in the crucible 7 by the lifting mechanism 5, and kept warm for 5 hours, so that the copper is immersed in the tungsten sponge matrix.
[0080] In step D, the tungsten sponge substrate dipped in oxygen-free copper is lifted aw...
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