RC-LIGBT device with substrate integrated with anti-parallel fly-wheel diode
A freewheeling diode and substrate integration technology, which is applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as circuit collapse, excessive local current, and difficulty in eliminating negative resistance effects, so as to reduce turn-off loss and eliminate The effect of the negative resistance Snapback effect
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Embodiment 1
[0044] Such as figure 1 As shown, this embodiment proposes a substrate-integrated anti-parallel freewheeling diode RC-LIGBT device, which includes: P+ emitter 1, N+ electron emitter 2, P-body3, N-type drift region 4, buffer Layer 5, P-type collector 6, N-type collector 7, silicon dioxide insulating layer 8, P-type substrate 9, emitter 10, gate 11 and collector 12.
[0045] The RC-LIGBT device is divided into an IGBT conductive region and a PIN diode region from top to bottom, and the IGBT conductive region and the PIN diode region are separated by a silicon dioxide insulating layer 8 . Wherein, the conductive region of the IGBT is formed by setting a P+ emitter 1, an N+ electron emitter 2, a P-body 3, an N-type drift region 4, a buffer layer 5, and a P-type collector 6. The PIN diode region is formed by a P+ emitter 1 , a P-type substrate 9 and an N-type collector 7 . The upper side of the silicon dioxide insulating layer 8 is closely connected with the lower side of the P-b...
Embodiment 2
[0049] Such as figure 2 As shown, a preferred RC-LIGBT device with substrate integrated anti-parallel freewheeling diode in the embodiment of the present invention can be further expanded and applied to RESURF theory and structure. figure 2 Including P+ emitter 1, N+ electron emitter 2, P-body 3, N-type drift region 4, buffer layer 5, P-type collector 6, N-type collector 7, silicon dioxide insulating layer 8, P-type substrate 9. The emitter 10, gate 11, collector 12, and P-top 13 are Double RESURF structures.
[0050] The upper side of the P-top 13 area is flush with the upper side of the N-type drift region 4 , and the left, lower and right sides are completely covered by the N-type drift region 4 . The N-type drift region 4 has a length of 18 μm, a thickness of 4 μm, and a doping concentration of 1×10 15 cm -3 . The P+ emitter 1 and the N+ electron emitter 2 are located below the emitter 10 , the left side of the N+ electron emitter 2 is completely covered by the P+ em...
Embodiment 3
[0053] Such as image 3 As shown, a preferred substrate-integrated anti-parallel freewheeling diode RC-LIGBT device in the embodiment of the present invention includes a P+ emitter 1, an N+ electron emitter 2, a P-body 3, an N-type drift region 4, and a buffer layer 5. P-type collector 6, N-type collector 7, silicon dioxide insulating layer 8, P-type substrate 9, emitter 10, gate 11, collector 12, P-type 14.
[0054] The P-type 14 region is completely covered by the N-type drift region 4 . The N-type drift region 4 has a length of 18 μm, a thickness of 4 μm, and a doping concentration of 1×10 15 cm -3 . The P+ emitter 1 and the N+ electron emitter 2 are located below the emitter 10 , the left side of the N+ electron emitter 2 is completely covered by the P+ emitter 1 , and the bottom and right sides are completely covered by the P-body 3 . The right side of the P-body 3 is next to the left side of the N-type drift region 4, the right side of the N-type drift region 4 is ne...
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