Air bridge structure, manufacturing method of air bridge structure, superconducting quantum chip and manufacturing method of superconducting quantum chip

Abstract

The embodiment of the invention provides an air bridge structure and a manufacturing method thereof, and a superconducting quantum chip and a manufacturing method thereof. According to the air bridge structure and the manufacturing method thereof, a bridge support structure is formed by using an inorganic material, and the shape of the bridge support structure can be adjusted by adjusting a first photoresist structure, so that the air bridge structure with the shape conforming to the expectation is obtained. The temperature in the process of forming the bridge support structure is not too high, so that the problem that the photoresist is difficult to remove due to the property change caused by the high temperature can be avoided, and the influence of the high temperature on the property of a temperature sensitive device can also be avoided; meanwhile, the empty bridge structure is obtained in a mode of stripping a second photoresist structure, and the air bridge material layer does not need to be etched, so that the air bridge structure at the bottom is prevented, and the performance of a product with the air bridge structure can be effectively improved.

Description

Technical field [0001] The present invention relates to a superconducting quantum chip technical field, particularly relates to an air bridge structure and a method of manufacturing a superconducting quantum chip and its manufacturing method. Background technique [0002] In order to reduce undesired capacitance of the circuit, such as parasitic capacitance to improve performance, the electronics products devices often introduce air bridge structure. Air bridge the prior art, in particular the preparation of superconducting main air bridge is using the photoresist reflow properties, arched prepared photoresist, then depositing a material on an upper portion thereof, and then exposing and developing the second gumming material covering the protective colloid and the remaining positions in the air bridge structure at a position etched away last used to glue all the photoresist is removed to give the air bridge. [0003] However, since the shape of the resist was refluxed limited na...

AI Technical Summary

Problems solved by technology

[0004] The application of the present invention aims at the shortcomings of the existing methods, and provides an empty bridge structure and its manufacturing method, a superconducting quantum chip and its manufacturing method, using inorganic materials as the bridge support material, and the bridge can be adjusted by adjusting the first photoresist structure The shape of the brace structure is used to obtain the expected empty bridge structure; and the temperature in the process of forming the bridge structure will not be too high, which can avoid the problems caused by the high reflow temperature of the photoresist; at the same time, the second photoresist structure is stripped The way to obtain the air bridge structure can avoid the problems caused by etching the air bridge material layer

Images