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Single-component thermosetting polyurethane structural adhesive and preparation method thereof

A polyurethane and structural adhesive technology, applied in the direction of polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve problems such as complex production operations, achieve sufficient operating time, and overcome the effects of oxygen inhibition.

Pending Publication Date: 2021-12-03
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention solves the complex production operation and free radical initiation of the existing polyurethane composition, and can well overcome the phenomenon of oxygen inhibition of polymerization, has no operating time limit, can be quickly cured only by heating, and can be used in electronics, industry, etc. , New energy bonding, sealing field

Method used

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  • Single-component thermosetting polyurethane structural adhesive and preparation method thereof
  • Single-component thermosetting polyurethane structural adhesive and preparation method thereof
  • Single-component thermosetting polyurethane structural adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] (1) Preparation of diisocyanate oligomers terminated by diols

[0033] Polytetrahydrofuran diol with a molecular weight of 500, BASF

[0034] Liquefied MDI with NCO content of 29 wt% diisocyanate, Wanhua Chemical Group Co., Ltd.

[0035] 100 parts of polytetrahydrofuran diol were dehydrated at 110°C for 1 hour, cooled to 50°C, added 115 parts of liquefied MDI, heated to 80°C under nitrogen protection, and reacted for 2 hours.

[0036] (2) Preparation of double bond-terminated diisocyanate oligomers

[0037] 100 parts of the diol-terminated diisocyanate oligomer prepared in (1) above, 15 parts of hydroxyethyl methacrylate, under the protection of nitrogen, the temperature was raised to 80° C., and the reaction was performed for 2 hours.

[0038] (3) Preparation of blocked isocyanate

[0039] 100 parts of HDI trimer (isophorone diisocyanate, the same below) and 55 parts of methyl ethyl ketoxime were reacted for 3 hours at 60° C. under nitrogen protection to test the NC...

Embodiment 2

[0043] (1) Preparation of diisocyanate oligomers terminated by diols

[0044] Polyether diol with a molecular weight of 500, Dow

[0045] Liquefied MDI NCO content is 29wt% diisocyanate Wanhua Chemical Group Co., Ltd.

[0046] Add 100 parts of polyether diol, heat up to 110°C for vacuum dehydration for 1 hour, cool down to 50°C, add 115 parts of liquefied MDI, raise the temperature to 80°C under nitrogen protection, and react for 2 hours.

[0047] (2) Preparation of double bond-terminated diisocyanate oligomers

[0048] 100 parts of the diisocyanate oligomer prepared in the above (1), 15 parts of hydroxyethyl methacrylate, under the protection of nitrogen, the temperature was raised to 80° C., and the reaction was carried out for 2 hours.

[0049] (3) Preparation of blocked isocyanate

[0050] 100 parts of HDI dimer and 38 parts of methyl ethyl ketoxime were reacted at 60°C for 3 hours under the protection of nitrogen to test the NCO content. When the NCO content was 0, the r...

Embodiment 3

[0054] (1) Preparation of diisocyanate oligomers terminated by diols

[0055] Polycaprolactone diol with a molecular weight of 500, Japan Daicel Co., Ltd.

[0056] Liquefied MDI NCO content is 29wt% diisocyanate Wanhua Chemical Group Co., Ltd. adds 100 parts of polycaprolactone diol, heats up to 110°C for vacuum dehydration for 1 hour, cools down to 50°C, adds 115 parts of liquefied MDI, and heats up under nitrogen protection to 80°C and react for 2 hours.

[0057] (2) Preparation of double bond-terminated diisocyanate oligomers

[0058] 100 parts of the diol-terminated diisocyanate oligomer prepared in the above (1) and 13 parts of allyl alcohol were heated up to 80° C. under the protection of nitrogen and reacted for 2 hours.

[0059] (3) Preparation of blocked isocyanate

[0060] 100 parts of liquefied MDI and 40 parts of diethylene glycol monobutyl ether were reacted at 60° C. for 3 hours under nitrogen protection to test the NCO content. When the NCO content was 0, the...

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Abstract

The invention discloses a single-component thermosetting polyurethane structural adhesive and a preparation method thereof. The single-component thermosetting polyurethane structural adhesive comprises a modified polyurethane prepolymer, a reactive diluent, an initiator and an activator. On the basis of free radical initiation, no oxygen inhibition phenomenon exists, an activator is released at a certain temperature to initiate generation of free radicals, and the purpose of curing is achieved. The method can be applied to many interface material bonding fields, and different assistants are added according to different application requirements.

Description

technical field [0001] The invention belongs to the field of adhesive materials, and in particular relates to a single-component thermosetting polyurethane structural adhesive and a preparation method thereof. Background technique [0002] Background The main problems of the currently used heat-curing one-component polyurethane adhesives are that the preparation process is relatively complicated, the unblocking temperature is high (about 160°C), harmful substances are volatilized after unblocking, and the system is not stable at room temperature in the presence of an amine curing agent. An unblocking reaction gradually occurred, and the stability was not satisfactory. In response to this situation, a series of research and improvement work has been carried out abroad in recent years, and great progress has been made in system simplification, improvement of storage stability and reduction of unsealing temperature. The storage period of more than one year meets the applicatio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14
CPCC09J175/14
Inventor 韩红伟王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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