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Sustainable heat dissipation structure based on memristor array and preparation method

A technology of heat dissipation structure and memristor, which is applied in the direction of electrical components, can solve the problem of scarcity of research, and achieve the effect of simple operation, improved performance, and large-scale application

Pending Publication Date: 2021-11-30
HOHAI UNIV
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  • Application Information

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Problems solved by technology

However, the microstructure of memristor heat dissipation is relatively rare due to its critical size and application limitations.

Method used

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  • Sustainable heat dissipation structure based on memristor array and preparation method
  • Sustainable heat dissipation structure based on memristor array and preparation method

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Embodiment Construction

[0024] The present invention will be further described below in conjunction with the accompanying drawings.

[0025] The sustainable heat dissipation structure based on the memristor array provided by the present invention includes a bottom electrode, an inverted substrate, a barrier layer and a substrate layer that are sequentially attached from top to bottom. The substrate layer is provided with a wire heat dissipation channel, and the longitudinal depth of the wire heat dissipation channel along the substrate layer is greater than the lateral depth, and the aspect ratio ranges from 1:10 to 1:20, and the embodiment of the present invention is preferably 1:16. A cooling liquid pipe is also provided at the bottom of the substrate layer, and the cooling liquid pipe is vertically arranged with the heat dissipation channel of the wire. The barrier layer is preferably a gallium nitride barrier layer. One of titanium, aluminum, nickel or gold is selected as the flipping substrate....

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Abstract

The invention provides a sustainable heat dissipation structure based on a memristor array and a preparation method. The heat dissipation structure comprises a bottom electrode, an overturning substrate, a barrier layer and a substrate layer which are sequentially attached to one another from top to bottom, wherein the substrate layer is provided with a wire heat dissipation channel; and the heat dissipation structure further comprises a cooling liquid pipeline perpendicular to the wire heat dissipation channel. The invention further provides a preparation method of the corresponding heat dissipation structure. The heat dissipation structure provided by the invention is good in heat conductivity and stability; the resistance state of the memristor attached to the heat dissipation structure is more stable; and the heat dissipation structure can be used for heat dissipation of a memristor network and has a wide application prospect; and in addition, the preparation method of the memristor provided by the invention is simple, convenient, efficient and low in cost, and can be widely applied to industrial production.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of integrated circuits, and mainly relates to a sustainable heat dissipation structure and a preparation method based on a memristor array. Background technique [0002] Memristor is the fourth type of passive component besides resistors, capacitors, and inductors. It is a passive circuit element related to magnetic flux and charge. As early as 1971, Professor Cai Shaotang theoretically predicted the existence of memristors based on circuit theory. In 2008, Hewlett-Packard Labs built a memristor prototype device experimentally for the first time, confirming Cai Shaotang's theory about memristors. Memristors have novel nonlinear electrical properties, and have the characteristics of high density, small size, low power consumption, and non-volatility. They are considered to be an ideal solution for the development of next-generation new non-volatile memory devices. The first object of the...

Claims

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Application Information

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IPC IPC(8): H01L45/00
CPCH10N70/841H10N70/8613H10N70/011
Inventor 余玉萍
Owner HOHAI UNIV
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