Single-wafer-type radio frequency plasma glue sweeping equipment

Abstract

The invention belongs to the technical field of wafer processing equipment and relates to single-wafer-type radio frequency plasma glue sweeping equipment. The equipment comprises an equipment main body; the equipment main body mainly comprises a wafer box placing mechanism, a wafer transfer robot, a wafer correction mechanism and a vacuum reaction cavity system; when the glue sweeping equipment works, firstly, a wafer box containing wafers is placed on the wafer box placing mechanism, the wafers are taken out through vacuum adsorption by the wafer transfer robot and are carried to the wafer correction mechanism to release vacuum for correction, and meanwhile, an automatic door opening and closing mechanism is controlled to open a door; and the corrected wafers are subjected to vacuum adsorption and taken out by the wafer transfer robot, and are put into a reaction cavity of the vacuum reaction cavity system, and the automatic door opening and closing mechanism is controlled to close the door. Thus, the problems of simple structure, single function and poor glue removing effect existing in most existing plasma glue sweeping equipment during use are solved. The equipment is used for single-wafer-type gluing of semiconductor wafers of 2-6 inches.

Description

technical field [0001] The invention relates to the technical field of wafer processing equipment, in particular to single-chip radio frequency plasma glue sweeping equipment. Background technique [0002] With the rapid development of technology, high-tech electronic products have been widely used in daily life, such as mobile phones, tablet computers, digital cameras and other electronic products. These electronic products include many semiconductor chips inside, and the material source of semiconductor chips is wafers. In order to meet the large demand for high-tech electronic products, the wafer manufacturing industry is constantly developing and improving how to make the wafer manufacturing process faster and more efficient. [0003] Most of the existing plasma glue sweeping equipment on the market have the defects of simple structure, single function and poor glue removal effect when used. Therefore, it is urgent to develop a single-chip radio frequency plasma glue sw...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a single-chip radio frequency plasma glue sweeping device, which solves the problems of simple structure, single function and poor glue removal effect in most of the existing plasma glue sweeping equipment when used. For single-chip gluing of 2 to 6-inch semiconductor wafers, through the generation of low-pressure, low-temperature plasma glow discharge, rapid chemical reaction and physical impact with the surface of the wafer to complete the deglue

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