Foam material, ultrathin damping foam material layer for damping of AMOLED module, assembly and preparation method

A foam, ultra-thin technology, applied in the direction of film/sheet adhesives, adhesives, etc., can solve problems such as unfavorable environmental protection

Pending Publication Date: 2021-11-16
上海叹止新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high-elastic acrylic foam consists of acrylic monomer, natural rubber, foaming microspheres and other additives. It is expected to achieve double elasticity by introducing rubber and foaming microspheres, and has good impact resistance. The preparation method of the above-mentioned highly elastic acrylic foam also uses organic solvents, which is not conducive to environmental protection

Method used

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  • Foam material, ultrathin damping foam material layer for damping of AMOLED module, assembly and preparation method
  • Foam material, ultrathin damping foam material layer for damping of AMOLED module, assembly and preparation method
  • Foam material, ultrathin damping foam material layer for damping of AMOLED module, assembly and preparation method

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Experimental program
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preparation example Construction

[0093]A method for preparing the ultra-thin foam material assembly for AMOLED module shock absorption, characterized in that it comprises the following steps:

[0094] S1, the synthesis of acrylate copolymer seed emulsion:

[0095] Add the monomer containing unsaturated carbon-carbon double bond, the first emulsifier and deionized water into the reaction kettle, under the condition of nitrogen protection, heat to 45-55°C and continuously stir and emulsify for 25-35 minutes, keep the reaction The device is under the condition of nitrogen protection, the initiator is dissolved in distilled water and then added dropwise to the reaction solution, the temperature is raised to 70-80°C, and the stirring reaction is continued for 3-4 hours to obtain the prepolymer emulsion A; the unsaturated carbon-carbon The weight ratio of the double bond monomer, the first emulsifier, the initiator and the deionized water is 40-60 parts / 0.5-5 parts / 0.05-0.1 parts / 40-60 parts.

[0096] Then massfra...

Embodiment 1

[0117] The ultra-thin foam assembly for AMOLED module shock absorption provided in this embodiment includes an ultra-thin shock-absorbing foam layer 1 and a release film layer 2, and the ultra-thin shock-absorbing foam layer and the release film layer pass through The adhesive layer 3 is bonded, and the thickness of the ultra-thin shock-absorbing foam layer is 0.05-0.5 mm. Its preparation method is as follows:

[0118] S1, the preparation of acrylate copolymer seed emulsion:

[0119] Add 20 grams of butadiene, 110 grams of styrene, 6 grams of sodium lauryl sulfate and 100 grams of deionized water into the reactor, and under nitrogen protection, heat to 50 ° C and continuously stir and emulsify for 30 minutes, keeping The reaction device was dissolved in 20 g of deionized water and 0.12 g of ammonium persulfate was dissolved in 20 g of deionized water and added dropwise to the reaction solution, the temperature was raised to 80 ° C, and the stirring reaction was continued for ...

Embodiment 2

[0133] The ultra-thin foam assembly for AMOLED module shock absorption provided in this embodiment includes an ultra-thin shock-absorbing foam layer 1 and a release film layer 2, and the ultra-thin shock-absorbing foam layer and the release film layer pass through The adhesive layer 3 is bonded, and the thickness of the ultra-thin shock-absorbing foam layer is 0.05-0.5mm. Its preparation method is as follows:

[0134] S1, preparation of acrylate copolymer seed emulsion

[0135] Add 20 grams of butadiene, 110 grams of styrene, 6 grams of sodium lauryl sulfate and 100 grams of deionized water into the reactor, and under nitrogen protection, heat to 50 ° C and continuously stir and emulsify for 30 minutes, keeping The reaction device was dissolved in 20 g of deionized water and 0.12 g of ammonium persulfate was dissolved in 20 g of deionized water and added dropwise to the reaction solution, the temperature was raised to 80 ° C, and the stirring reaction was continued for 3 hour...

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Abstract

The invention discloses a foam material, an ultrathin damping foam material layer for damping of an AMOLED module, an assembly and a preparation method, the foam material is a foam body material which is prepared from a film-forming polymer and internally provided with a foam structure, and the density of the foam body material is 0.4-0.9 g/cm < 3 >; the foam body material has a loss factor not lower than 0.4 in a temperature interval of 10-30 DEG C; the glass transition temperature Tg of the film-forming polymer is (-10)-30 DEG C, and the film-forming polymer is formed by copolymerizing at least two or more different monomers with the Tg difference larger than 50 DEG C. The foam material prepared by the invention can absorb impact force, has excellent impact resistance, and can be widely applied to mobile phones, tablet personal computers, pen televisions, vehicle-mounted equipment and wearable equipment as a buffer material by utilizing the characteristic.

Description

technical field [0001] The invention relates to compressible ultra-thin shock-absorbing and damping foam, in particular to a foam material, an ultra-thin shock-absorbing foam material layer for AMOLED module shock absorption prepared by using the foam surface material, containing the An ultra-thin foam component of an ultra-thin shock-absorbing foam material layer, and a preparation method for the ultra-thin foam component. Background technique [0002] With the development of science and technology, people's lives are inseparable from electronic display devices, such as mobile phones and computers. Due to the many advantages of AMOLED, AMOLED technology is more widely used than LCD technology, and can be extended to the fields of electronic products, commercial fields, transportation fields, industrial control fields, and medical fields. Electronic devices are easy to bump and fall during use or transportation, so it is necessary to paste a layer of cushioning material foa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J9/32C08F257/02C08F212/08C08F220/44C08F2/26C08F2/30C09J7/26
CPCC08J9/32C08F257/02C08F2/26C08F2/30C09J7/26C08J2351/00C08J2203/22C08J2205/052C08J2205/044C09J2400/243C08F212/08C08F220/44
Inventor 张长星苏炎召
Owner 上海叹止新材料科技有限公司
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