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Preparation method of micro-nano metal particle surface coating

A metal particle, micro-nano technology, applied in the field of surface engineering, can solve the problems of growing on the cathode and difficult to form a coating, etc., achieve high material utilization rate, good performance at high temperature, and improve connection performance

Active Publication Date: 2021-11-02
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that it is difficult to form a coating on the surface of the existing micro-nano metal particles, and to provide a method for preparing a coating on the surface of the micro-nano metal particles. Form a coating on the surface of the metal particles to improve the utilization of the plating solution; control the flow rate of the plating solution to flush the cathode to avoid the phenomenon of metal particles growing on the cathode; introduce multiple pairs of electrodes into the fluid system to improve the efficiency of electroplating

Method used

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  • Preparation method of micro-nano metal particle surface coating
  • Preparation method of micro-nano metal particle surface coating
  • Preparation method of micro-nano metal particle surface coating

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specific Embodiment approach 1

[0029] Specific embodiment one: what this embodiment records is a kind of preparation method of micronano metal particle surface coating, and the specific steps of described method are as follows:

[0030] Step 1: Select the micro-nano metal particles to be electroplated, and remove the oxide film on their surface;

[0031] Step 2: Select and configure the plating solution to be electroplated, select and make the electrode for electroplating;

[0032] Step 3: Mixing the micro-nano metal particles obtained in step 1 with the plating solution in step 1 to prevent the micro-nano metal particles from being oxidized in the air;

[0033] Step 4: Assembling the electroplating device, the electroplating device specifically includes an electroplating tank, a micro-flow tube, a micro-pump and a power supply; the micro-flow tube includes a vertical section and a transition section, such as figure 2 Shown; Described vertical section arranges many pairs of electroplating electrodes and t...

specific Embodiment approach 2

[0042] Embodiment 2: The method for preparing a coating on the surface of micro-nano metal particles described in Embodiment 1, in step 1, the micro-nano metal particles to be electroplated are spherical particles with a diameter of 50 nm to 10 μm, and the material is Copper and other micro-nano metal particles with good electrical conductivity.

specific Embodiment approach 3

[0043] Embodiment 3: In the method for preparing a coating on the surface of micro-nano metal particles described in Embodiment 1, in the circulation process of the plating solution, it is necessary to ensure that the plating solution remains in a continuous state without bubbles in the micro-flow tube.

[0044] Specific embodiment four: the preparation method of a kind of micro-nano metal particle surface coating described in specific embodiment one, in step eight, the flow velocity of plating solution in the micro-flow tube is 0.1m / s, and this flow rate makes in electroplating process, micro The nano metal particles stay in the cathode for a short time to complete the electroplating, and due to the scouring of the water flow, the micro and nano metal particles will not grow on the surface of the cathode and enter the plating solution.

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Abstract

The invention discloses a preparation method of a micro-nano metal particle surface coating, and belongs to the field of surface engineering. The method comprises the following steps: a plating solution for electroplating is selected and prepared, micro-nano metal particles to be electroplated are selected, surface oxidation films are removed from the selected micro-nano metal particles, the micro-nano metal particles are mixed with a weakly acidic plating solution and the mixture is added into an electroplating bath, a magnetic rotor is added into the electroplating bath to stir the electroplating solution so as to make the micro-nano metal particles uniformly dispersed in the plating solution, and stirring is not stopped in the electroplating process, a micropump power source is turned on, the electroplating solution is made to stably circulate in a micropipe, an electroplating power source is turned on for electroplating, electroplating is completed after a certain period of time, the electroplating solution obtained after electroplating is centrifugally dried to obtain micro-nano metal particles with good coatings. The micro-nano metal particle surface coating can be applied to solder balls of electronic packaging fields of flip chip bonding, ball grid array packaging and the like, and has the advantages of low resistance, high signal transmission capability, high electromigration resistance, high creep resistance and the like.

Description

technical field [0001] The invention belongs to the field of surface engineering, and in particular relates to a method for preparing a coating on the surface of micronano metal particles. Background technique [0002] With the continuous development and innovation of electronic packaging technology, the density of integrated circuits (IC, Integrated Circuit) is getting higher and higher. Integration density and performance are further improved. Most of the high-density electronic packaging technologies include the ball planting process, that is, the solder balls that play the role of connection and signal transmission are implanted into the pad position. These solder balls are the most prone to failure locations, so their performance requirements are more stringent. For example, metal copper has the advantages of low resistance, strong signal transmission ability, strong resistance to electromigration and creep resistance, and metal tungsten has good high-temperature serv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/00C25D5/08C25D3/48C25D3/12
CPCC25D7/006C25D7/00C25D5/08C25D3/12C25D3/48
Inventor 郑振张茜琳龚耀龙刘威孔令超
Owner HARBIN INST OF TECH
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