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Two-phase phase change heat dissipation device and terminal device

A technology for heat dissipation and phase change, which is applied in lighting and heating equipment, indirect heat exchangers, electrical equipment structural parts, etc. The effect of increasing fluid storage and increasing flexibility

Inactive Publication Date: 2021-10-22
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] One purpose of the present application is to provide a two-phase phase change heat dissipation device, which aims to increase the maximum heat transfer capacity of the two-phase phase change heat dissipation device, enhance the phase change heat dissipation efficiency, and solve the problem of poor heat dissipation performance of the two-phase phase change heat dissipation device

Method used

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  • Two-phase phase change heat dissipation device and terminal device
  • Two-phase phase change heat dissipation device and terminal device
  • Two-phase phase change heat dissipation device and terminal device

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Embodiment Construction

[0071] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0072] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0073] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations or posi...

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Abstract

The invention discloses a two-phase phase change heat dissipation device, and relates to the field of heat dissipation. The two-phase phase change heat dissipation device comprises a sealed structure, a capillary structure arranged in the sealed structure and a working medium arranged in the sealed structure. The middle area of the sealed structure is a transfer section, one end is an evaporation section, and the other end is a condensation section. The two ends of the sealed structure are closed, and a cavity communicated with the condensation section, the transfer section and the evaporation section is formed in the sealed structure. The capillary structure is arranged in the cavity and used for providing capillary adsorption force for the working medium in the cavity so that the working medium can return to the evaporation section from the condensation section along the capillary structure. The inner wall of the evaporation section of the sealed structure is provided with a first groove structure which can be used for containing the liquid working medium, the liquid storage amount of the working medium in the two-phase phase change heat dissipation device is increased, the heat exchange area of the liquid working medium and the inner wall of the evaporation section is increased, meanwhile, the vaporization core of the inner wall of the evaporation section is improved, and then the heat absorption and heat dissipation capability of the two-phase phase change heat dissipation device is improved.

Description

technical field [0001] The present application relates to the technical field of phase change heat dissipation, in particular to a two-phase phase change heat dissipation device and terminal equipment. Background technique [0002] With the diversification of functions of terminal equipment such as mobile phones and tablets, the computing and processing performance of modules such as chips inside terminal equipment has also been significantly improved. Optimum operating temperature of the chip is a necessary condition for it to maintain functional work. Therefore, in order to ensure the stable and continuous high-performance operation of modules with serious heat generation such as chips, two-phase heat pipes and VC (Vapor Chamber) are usually used. Phase change heat sinks transfer heat from areas of higher temperature to other areas. At the same time, the lightweight and ultra-thin requirements of handheld products have further compressed the thickness of the product stack...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04H05K7/20
CPCF28D15/046F28D15/043H05K7/20336F28D15/04H05K7/20F28D15/02
Inventor 刘用鹿汤勇靳林芳聂聪陈恭王英先
Owner HUAWEI TECH CO LTD
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