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Soldering paste preparation and canning process for Micro Led

A solder paste and process technology, which is applied in the field of solder paste preparation and canning process, can solve the problems of reducing LED lighting efficiency and service life, unfavorable LED product promotion and application, and increasing LED product production costs, so as to improve welding work efficiency. , conducive to widespread promotion and application, and the effect of enhancing comprehensive competitiveness

Inactive Publication Date: 2021-10-08
烟台固邦新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a preparation and canning process of solder paste for Micro Led, which solves the problem that the existing solder paste is commonly used in LED devices to have welding voids, which affect the heat conduction effect of the soldering interface. , thereby reducing the light efficiency and service life of LED lamps, and the content of tin in the existing solder paste is relatively high, which greatly increases the production cost of LED products, which is not conducive to the widespread promotion and application of LED products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The embodiment of the present invention provides a solder paste preparation and canning process for Micro Led, which is composed of alloy tin powder and flux, the weight percentage of alloy tin powder is 91%, and the weight percentage of flux is 9%. Alloy tin powder is ultrasonic atomized tin powder or centrifugal atomized tin powder, and the particle size range can be 20-38 microns, wherein: alloy tin powder includes the following components by weight: 50% tin powder, 47% lead powder %, bismuth powder 2.5%, reinforcing metal 0.5%, the soldering flux includes the following components by weight: rosin 40%, solvent 35%, active agent 5%, thixotropic agent 4%, antioxidant 5%, Emulsifier 8%, additive 3%.

[0035] A kind of solder paste preparation and canning process for Micro Led, it is characterized in that: comprise the following steps:

[0036] S1. First add rosin and solvent into the high-pressure ultrasonic reactor in proportion, heat up to 80°C, then start the mechan...

Embodiment 2

[0047] The embodiment of the present invention provides a solder paste preparation and canning process for Micro Led, which is composed of alloy tin powder and flux, the weight percentage of alloy tin powder is 90%, and the weight percentage of flux is 10%. Alloy tin powder is ultrasonic atomized tin powder or centrifugal atomized tin powder. %, bismuth 4%, reinforcing metal 1%, and the flux includes the following components by weight: rosin 40%, solvent 30%, active agent 6%, thixotropic agent 5%, antioxidant 6%, emulsifying agent Agent 9%, additive 4%.

[0048] A kind of solder paste preparation and canning process for Micro Led, it is characterized in that: comprise the following steps:

[0049] S1. First add rosin and solvent into the high-pressure ultrasonic reactor in proportion, heat up to 90°C, then start the mechanical stirring device, set the speed of the mechanical stirring device to 1200-1800r / min, and set the stirring time to 100 minutes. The solid melts complete...

Embodiment 3

[0058] The embodiment of the present invention provides a solder paste preparation and canning process for Micro Led, which is composed of alloy tin powder and flux, the weight percentage of alloy tin powder is 89%, and the weight percentage of flux is 11%. Alloy tin powder is ultrasonic atomized tin powder or centrifugal atomized tin powder. %, 5.5% of bismuth powder, 1.5% of reinforcing metal, and the flux includes the following components by weight: rosin 40%, solvent 29%, active agent 8%, thixotropic agent 5%, antioxidant 5%, Emulsifier 8%, additive 5%.

[0059] A kind of solder paste preparation and canning process for Micro Led, it is characterized in that: comprise the following steps:

[0060] S1. First add rosin and solvent into the high-pressure ultrasonic reactor in proportion, heat up to 90°C, then start the mechanical stirring device, set the speed of the mechanical stirring device to 1200-1800r / min, and set the stirring time to 90 minutes. The solid melts compl...

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Abstract

The invention provides a solder paste preparation and canning process for Micro Led, and relates to the technical field of solder paste. According to the preparation and canning process of the soldering paste for the Micro Led, the soldering paste is composed of alloy tin powder and scaling powder, the weight percentage of the alloy tin powder is 89%-91%, the weight percentage of the scaling powder is 9%-11%, and the alloy tin powder comprises the following components in parts by weight: 35%-55% of tin powder, 35%-65% of lead powder, 1%-10% of bismuth powder and 0.5%-2% of reinforcing metal. According to the soldering paste preparation and canning process for Micro Led, the formula design is unique and reasonable, the components and the proportion of the soldering powder and the soldering flux are optimized, the welding effect of the soldering paste can be effectively improved, compared with common alloy soldering powder Sn63Pb37, the component dosage of tin is reduced, the production cost of the soldering paste is reduced, the packaging cost of an LED product is reduced, and the economic benefit of soldering paste production is improved.

Description

technical field [0001] The invention relates to the technical field of solder paste, in particular to a preparation and canning process of solder paste for Micro Led. Background technique [0002] Solder paste is a kind of alloy solder. Solder paste can fix electronic components on the circuit board. When it is heated to a certain temperature, it will be melted, so that the soldered components and the circuit board are connected together. After cooling, it solidifies to form a fixed solder joint. [0003] Due to the advantages of high luminous efficiency, low power consumption, long service life, and low operating temperature, LED products are widely used in lighting, display, decoration and other fields. Due to the advantages of LED and the support of relevant policies, domestic LED technology has been recognized Rapid development has gradually narrowed the gap with foreign technologies, and even led the world in the field of some products. However, due to the problem of L...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40B23K35/26B65B3/04
CPCB23K35/40B23K35/26B23K35/262B23K35/268B65B3/04
Inventor 秦超
Owner 烟台固邦新材料有限公司
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