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Novel wood composite floor

A composite floor and wood technology, applied in the direction of floors, insulation layers, buildings, etc., can solve the problems of crack resistance, poor toughness, no technical solutions, and easy cracking of wood grain paper, etc., to achieve good crack resistance Cracking and toughness, and the effect of improving the bonding strength

Pending Publication Date: 2021-09-24
红木枋家居科技(湖州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the crack resistance and toughness of wood grain paper are relatively poor, while the wood substrate has the characteristics of drying shrinkage and wet expansion, and its toughness is relatively good. Therefore, when the two are bonded and combined, the surface of wood grain paper is more likely to occur crack
[0003] There is not yet a technical solution that can better solve the above problems in the prior art

Method used

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  • Novel wood composite floor
  • Novel wood composite floor
  • Novel wood composite floor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Example 1: Reference figure 1 A new wood composite floor is shown, which includes a wear-resistant layer 700, a wood grain paper layer 200, a fiber paper layer 300, a wooden substrate layer 100, a back decoration layer 800 and a transparent moisture-proof layer 900 from the surface to the bottom. Wherein, the wear-resistant layer 700 is any kind of wear-resistant paper in the prior art, such as Al2O3 impregnated paper; the wood grain paper layer 200 is any kind of decorative paper in the prior art; the fiber used in the fiber paper layer 300 The paper is melamine-impregnated fiber paper; the wooden substrate layer 100 can be any kind of wooden composite substrate, such as multi-layer solid wood composite substrate; the back decoration layer 800 can be any kind, such as decorative paper or fast-growing wood veneer; transparent The moisture-proof layer 900 can be any kind, such as pvc coating.

[0028] By sticking the fiber paper layer 300 between the wood substrate laye...

Embodiment 2

[0030] Embodiment 2: the difference between embodiment 2 and embodiment 1 is that, refer to figure 2 , image 3 As shown, a high-density fiberboard layer 400 is glued between the fiber paper layer 300 and the wood substrate layer 100 . In this embodiment, the thickness of the high-density fiberboard used in the high-density fiberboard layer 400 is 0.8 mm to 1.2 mm, and the density is 0.9 kg / m 3 ~1.2kg / m 3 , preferred thickness 1.0mm, preferred density 1.0kg / m 3 .

[0031] Through the setting of the high-density fiberboard layer 400, the wood grain paper layer 200 and the fiber paper layer 300 have a relatively flat sticking plane, so as to avoid to a certain extent due to the wood substrate layer 100 (originally having or caused by deformation) ) surface unevenness (especially multi-layer solid wood composite substrate) and form fine wrinkles on the wood grain paper layer 200, fiber paper layer 300, and affect the quality of product surface flatness.

[0032] Those of or...

Embodiment 3

[0034] Embodiment 3: the difference between embodiment 3 and embodiment 1 is that, refer to Figure 4As shown, a first balancing paper layer 500 is glued between the high-density fiberboard layer 400 and the wooden substrate layer 100 , and a second balancing paper layer 600 is glued on the back of the wooden substrate layer 100 . The first balancing paper layer 500 is 60 g melamine impregnated paper and the second balancing paper layer 600 is 120 g melamine impregnated paper.

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Abstract

The embodiment of the invention discloses a novel wood composite floor which comprises a wood base material layer and a grainy paper layer adhered to the wood base material layer, and a fiber paper layer is lined between the wood base material layer and the grainy paper layer. The grainy paper layer on the surface layer of the floor has relatively good cracking resistance and toughness, so that the quality problem of cracking of the grainy paper layer due to shrinkage and expansion size changes of a wood base material can be effectively avoided.

Description

technical field [0001] The invention relates to the technical field of floor covering materials, in particular to a novel wood composite floor. Background technique [0002] Avoiding the use of precious hard broad-leaved materials has become a major issue in the green building materials manufacturing industry. In order to save the use of precious hard broad-leaved wood and improve the solid wood characteristics of wooden floors, wood grain paper is often glued on the wooden substrate to replace precious hard hard broad-leaved wood to achieve a decorative effect. However, the crack resistance and toughness of wood grain paper are relatively poor, while the wood substrate has the characteristics of drying shrinkage and wet expansion, and its toughness is relatively good. Therefore, when the two are bonded and combined, the surface of wood grain paper is more likely to occur Cracked. [0003] There is no technical solution that can better solve the above problems in the prior...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F15/02E04F15/10E04F15/18
CPCE04F15/02E04F15/107E04F15/181
Inventor 张子铭张超彭立民李小科姜俊
Owner 红木枋家居科技(湖州)有限公司
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