PCB pattern transfer alignment target method

Abstract

The invention discloses a PCB pattern transfer alignment target method. The method comprises the following steps: drilling alignment target holes in a PCB; continuously machining shunting holes along the edge of the outer side of the alignment target hole; processing a laser through hole in the PCB; carrying out copper plating on the PCB, and shunting redundant copper at the position of the alignment target hole into the shunting holes; and performing pattern transfer alignment by using the alignment target hole to generate a circuit conductive pattern of the PCB. In the copper plating process, the shunting holes are designed around the alignment target holes for protection, the effects of shunting the electroplating density and increasing the electroplating area are achieved in the complex waveform pulse electroplating process, the diameter consistency of the alignment target holes can be effectively protected, the stability is improved, and the influence of copper thickness protrusions is reduced; the uniformity of the copper thickness in the alignment target hole is improved, the product problems of exposure rejection, deviation of the pattern PAD and the laser hole and the like in the pattern transfer process are avoided, the production efficiency is improved, and the alignment degree of the pattern PAD and the laser hole is improved.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a target method for transferring and aligning PCB graphics. Background technique [0002] At present, with the development of light, thin, short and small PCB boards, the design of laser holes is getting smaller and smaller, which is very easy to cause laser holes to collapse. Recently, the design of laser blind holes has developed to the level of laser drilled through hole design. (i.e. X-via). [0003] However, the existing pattern transfer alignment target method has the following defects: [0004] During the copper plating process for the alignment target hole, due to the uniform copper plating, copper thick bumps will be formed around the alignment target hole, which seriously affects the accuracy of the diameter of the alignment target hole, and alignment targets often appear. The problem of different diameters reduces the production efficiency and causes the bad defect of g...

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the deficiencies of the prior art, one of the objectives of the present invention is to provide a PCB board pattern transfer alignment target method, which can solve the problems of different diameters of alignment targets and reduced production efficiency

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