A kind of high thermal conductivity polyimide film and its production process

Abstract

The invention discloses a polyimide film with high thermal conductivity, which belongs to the technical field of polyimide film. The polyimide film comprises the following raw materials in parts by weight: 35.4-50.6 parts of diamine monomer, an aprotic polar solvent 120-200 parts, 41.2-62.1 parts of aromatic dianhydride monomer, 4.5-10.6 parts of thermal conductive filler, and 0.5-1.1 part of dispersant. The invention also discloses the production process of the polyimide film. Through the selection of polyimide synthesis monomers, a polyimide film with high thermal conductivity and high transparency is prepared, which expands its broad spectrum of application in the field of solar cells. The high thermal conductivity and high transparency of the film are mainly composed of diamine Due to the presence of polyphenyl ring structures in diamine monomers, the crystallinity of the polymer is greatly increased, and the well-arranged lattice can conduct heat through thermal vibration, realize phonon heat conduction, and significantly improve the polyimide film. Thermal Conductivity.

Description

technical field [0001] The invention belongs to the technical field of polyimide films, and relates to a polyimide film with high thermal conductivity and a production process thereof. Background technique [0002] Polyimide (PI) film is a highly competitive high-temperature insulating material, which has been widely used in flexible printed circuit substrates, microelectronic integrated circuits, battery packaging and special electrical appliances. However, in these fields, microelectronics are in a high-density and high-speed operation state, which makes electronic components and integrated circuits dissipate a lot of heat. Because polyimide itself is almost a poor conductor of heat, the thermal conductivity of traditional polyimide film is about 0.16W / (m K), which has poor thermal conductivity and is easy to accumulate heat, which affects the stability, life and safety of electronic components. It is safe to operate and limits the upgrading of related industries. In ord...

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Problems solved by technology

[0003] Referring to the high thermal conductivity polyimide film disclosed by Chinese patent CN111630088A containing two or more fillers, the invention improves the plane direction thermal conductivity of the polyimide film by adding carbon-based or boron-based fillers and metal oxide-based fillers rate and thermal conductivity in the thickness direction, but when the amount of thermally conductive filler is small, although the fillers can be uniformly dispersed in the resin, they cannot form mutual contact and interaction with each other, and the thermal conductivity does not improve much, while when the amount of filler is large , although the thermal conductivity of the film is greatly improved, the comprehensive properties of the film, especially the mechanical and tear resistance properties, are significantly reduced, and even the salivation and stretching of the film cannot be achieved, and industrial production cannot be realized. At the same time, the polyimide molecular chain conjugate absorbs The role of the intramolecular and intermolecular charge transfer complexes makes the polyimide film very dark in color and has low transmittance in the visible light band, which limits its application in the field of solar cells

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