Cutting steel wire surface treatment device for semiconductor wafer

Abstract

The invention discloses a cutting steel wire surface treatment device for a semiconductor wafer. The cutting steel wire surface treatment device comprises a device body, a hot air fan, a fixing frame, a supporting plate, a collecting box and third hydraulic telescopic rods, brush rollers are rotationally connected to the position, close to the left side, in the device body, the upper ends of the brush rollers penetrate through the device body to be connected with first rotating shafts, the left first rotating shaft and the right first rotating shaft are connected through a toothed belt, the front first rotating shaft and the rear first rotating shaft on the right side are in meshed connection through first gears, the first gears are arranged on the first rotating shafts in a penetrating mode, and meanwhile the first rotating shaft on the right rear side is connected with a first motor. According to the cutting steel wire surface treatment device for the semiconductor wafer, a cutting steel wire raw material penetrates through the brush rollers, the brush rollers are driven to rotate through the gears, the toothed belt and the first rotating shaft under the action of the first motor, rust removal treatment is conducted on the cutting steel wire raw material through the brush rollers in a mechanical mode, and follow-up surface treatment machining is facilitated, and in addition, flying dust generated in the rust removal process can be sucked into the collecting box under the action of a draught fan and a suction pipe.

Description

technical field [0001] The invention relates to the technical field related to wafers, in particular to a cutting wire surface treatment device for semiconductor wafers. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer. The wafer needs to be cut into pieces during the production process. The general wafer cutting methods include laser cutting and traditional knife cutting. Saw blade or grinding wheel cutting and cutting steel wire cutting, cutting steel wire is also known as cutting steel wire, the cutting effect is second only to laser cutting, compared with laser cutting, it can effectively save energy, compared with traditional grinding wheel c...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a cutting wire surface treatment device for semiconductor wafers, to solve the problem that most of the cutting wire surface treatment devices proposed in the above-mentioned background technology have poor processing effects, and mechanically pre-process the steel wire surface before the steel wire surface treatment. Rust removal, and because the cut steel wire needs to be wound after surface treatment, it is convenient for subsequent wire drawing processing, but because the cut steel wire after winding is heavy, manual handling is more troublesome

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