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Multi-size micro-nano metal particle soldering paste in-situ interconnection process and product thereof

A metal particle, micro-nano technology, used in metal processing equipment, welding media, manufacturing tools, etc., can solve the problems of high paste sintering temperature, easy oxidation of nano copper particles, and complicated solder paste preparation process.

Pending Publication Date: 2021-09-14
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the problems raised by the background technology, the purpose of the present invention is to propose an in-situ interconnection process of multi-size micro-nano metal particle solder paste, which realizes more convenient, fast and efficient preparation of metal solder paste, simple process, convenient storage and application , which solves the problems of complex preparation process of existing solder paste, high paste sintering temperature, and easy oxidation of nano-copper particles

Method used

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  • Multi-size micro-nano metal particle soldering paste in-situ interconnection process and product thereof
  • Multi-size micro-nano metal particle soldering paste in-situ interconnection process and product thereof
  • Multi-size micro-nano metal particle soldering paste in-situ interconnection process and product thereof

Examples

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Effect test

Embodiment 1

[0056] An in-situ interconnection process of multi-size micro-nano metal particle solder paste, comprising the following steps:

[0057] (a) Dissolve the copper salt (specifically copper acetate) in a solvent (specifically 500mL ethylene glycol) at 50°C, add a reducing agent (specifically ascorbic acid) and micron metal particles (specifically ethylene glycol) into the solvent 1 μm copper particles), wherein the molar ratio of copper salt to reducing agent is 1:6, and the molar ratio of copper salt to micron metal particles is 1:1, and the multi-size micronano metal particle dispersion is obtained after stirring and reacting for 20 minutes;

[0058] (b) Concentrating the multi-size micro-nano metal particle dispersion prepared in the step (a), pouring the multi-size micro-nano metal particle dispersion prepared in the step (a) into a centrifuge tube In, under the condition of 12000r / min, centrifuge 5min in centrifuge, then stir to make multi-size micro-nano metal particle sold...

Embodiment 2

[0061] An in-situ interconnection process of multi-size micro-nano metal particle solder paste, comprising the following steps:

[0062] (a) Dissolve the copper salt (specifically copper acetate) in a solvent (specifically 500mL ethylene glycol) at 50°C, add a reducing agent (specifically ascorbic acid) and micron metal particles (specifically ethylene glycol) into the solvent 1 μm copper particles), wherein the molar ratio of copper salt to reducing agent is 1:1, and the molar ratio of copper salt to micron metal particles is 1000:1, and the multi-size micronano metal particle dispersion is obtained after stirring and reacting for 20 minutes;

[0063] (b) Concentrating the multi-size micro-nano metal particle dispersion prepared in the step (a), pouring the multi-size micro-nano metal particle dispersion prepared in the step (a) into a centrifuge tube In, under the condition of 12000r / min, centrifuge 5min in centrifuge, then stir to make multi-size micro-nano metal particle s...

Embodiment 3

[0066] An in-situ interconnection process of multi-size micro-nano metal particle solder paste, comprising the following steps:

[0067] (a) Dissolve the copper salt (specifically copper acetate) in a solvent (specifically 500mL ethylene glycol) at 50°C, add a reducing agent (specifically ascorbic acid) and micron metal particles (specifically ethylene glycol) into the solvent 1 μm copper particles), wherein the molar ratio of copper salt to reducing agent is 1:10, and the molar ratio of copper salt to micron metal particles is 1:10, and the multi-size micronano metal particle dispersion is obtained after stirring and reacting for 20 minutes;

[0068] (b) Concentrating the multi-size micro-nano metal particle dispersion prepared in the step (a), pouring the multi-size micro-nano metal particle dispersion prepared in the step (a) into a centrifuge tube In, under the condition of 12000r / min, centrifuge 5min in centrifuge, then stir to make multi-size micro-nano metal particle so...

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Abstract

The invention discloses a multi-size micro-nano metal particle soldering paste in-situ interconnection process and a product thereof. The multi-size micro-nano metal particle soldering paste in-situ interconnection process comprises the following steps that (a) copper salt is dissolved in a solvent, a reducing agent and micron metal particles are added into the solvent, and after stirring and reacting, multi-size micro-nano metal particle dispersion liquid is obtained; and (b) the multi-size micro-nano metal particle dispersion liquid prepared in the step (a) is concentrated. According to the multi-size micro-nano metal particle soldering paste in-situ interconnection process, more convenient, faster and more efficient preparation of metal soldering paste is achieved, the process is simple, storage and application are convenient, the multi-size micro-nano metal particle soldering paste is prepared through the multi-size micro-nano metal particle soldering paste in-situ interconnection process, the oxidation degree of nano-copper particles in the soldering paste is low, the density of a sintered body can be effectively improved, and the shear strength and the electric conductivity are enhanced.

Description

technical field [0001] The invention relates to the technical field of electronic manufacturing, in particular to an in-situ interconnection process of multi-size micro-nano metal particle solder paste and its products. Background technique [0002] With the rapid development of electronic technology, the goal of packaging and interconnection of electronic components is to achieve stable electrical interconnection, thermal connection and mechanical connection with sufficient strength. Stable packaging and interconnection ensure that electronic components work better. The development of silicon carbide and gallium nitride high-temperature devices enables power electronic modules to be used at high temperatures. Solder paste and conductive glue, as traditional interconnect materials, can no longer meet the requirements of high-power devices. The above problems put forward higher requirements for packaging and interconnection: (1) ensure reliable mechanical connection; (2) ens...

Claims

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Application Information

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IPC IPC(8): B23K35/40B23K35/02B23K35/24B23K35/30
CPCB23K35/40B23K35/025B23K35/24B23K35/302
Inventor 张昱黄钟伟崔成强吴松梁沛林杨冠南
Owner GUANGDONG UNIV OF TECH
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