Method for laminating ABF layer-adding film and copper foil to inner-layer substrate

Abstract

The invention provides a method for laminating an ABF layer-adding film and a copper foil to an inner-layer substrate. The method comprises the following steps: performing first vacuum laminating treatment on a first ABF layer-adding film and the inner-layer substrate to obtain a first layer-adding circuit board; performing second vacuum lamination processing on the copper foil and the first layer-adding circuit board to obtain a second layer-adding circuit board; and performing first leveling treatment on the second layer-adding circuit board to obtain a third layer-adding circuit board. Or the method comprises: carrying out first vacuum lamination processingon the first ABF layer-adding film and the inner-layer substrate are subjected to obtain a first layer-adding circuit board; performing first vacuum lamination treatment on the second ABF layer-adding film and the copper foil to obtain a first copper foil layer-adding plate; performing second leveling treatment on the first layer-adding circuit board to obtain a fourth layer-adding circuit board; and performing first vacuum lamination processing on the fourth layer-adding circuit board and the first copper foil layer-adding board to obtain a fifth layer-adding circuit board. Or the first ABF layer-adding film and the inner-layer substrate are subjected to first vacuum lamination processing to obtain a first layer-adding circuit board; and the first layer-adding circuit board, the prepreg and the copper foil are sequentially stacked, and second vacuum lamination processing is carried out to obtain a sixth layer-adding circuit board.

Description

technical field [0001] The invention relates to the technical field of circuit board packaging, in particular to a method for laminating an ABF build-up film and copper foil to an inner substrate. Background technique [0002] Semi-additive technology is the main processing and manufacturing technology for high-density packaging substrates. For high-density packaging substrate technology, especially FCBGA packaging substrate technology, semi-additive technology has made unprecedented progress. 25um has been reduced to mass production 8um / 8um. [0003] ABF (Ajinomoto Build-up Fihn: Ajinomoto Build-up Film) material is an interlayer insulating material for high-density packaging substrate circuits produced by Ajinomoto Corporation in Japan. The ABF material does not contain glass fiber, and it is not only used in high-density wiring, but also used in other situations. For example, in the case of a thick substrate through hole with a high aspect ratio, the metallized hole nee...

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Problems solved by technology

[0006] In view of the above problems, the present invention proposes a method of pressing the ABF build-up film and copper foil to the inner substrate, in order to solve the copper foil blistering caused by the vaporization of the solvent in the ABF build-up film in the prior art, The problem that the line cannot be processed

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