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Dual-passband balance power division filter adopting double-layer circular patches

A filter and dual-passband technology, applied in the field of microwave passive devices, can solve the problems of large size, complex filter design, large insertion loss, etc.

Active Publication Date: 2021-09-10
NANJING IND INST FOR ADVANCED INTELLIGENT EQUIP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the design of this dual-passband balanced power divider filter is relatively complicated, and the return loss is poor, and the isolation between output ports is not ideal.
[0004] Document 2 [P.L.Chi, Y.M.Chen, and T.Yang, "Single-layer dual-band balanced substrate-integrated waveguide filtering power divider for 5G millimeter-waveapplications," IEEE Microw.Wireless Compon. Lett., vol.30, no. 6, pp.585-588, June.2020.] By properly designing the differential mode and common mode of the three cavities of the SIW to form a three-pole passband, a dual-passband power division filter with balanced performance is proposed, however , the problems of large insertion loss and large size limit the wide application of this balanced power dividing filter
[0005] Document 3 [Q.Liu, J.Wang, L.Zhu, G.Zhang and W.Wu, "Design of a new balanced-to-balanced filtering power divider based on square patch resonator," IEEETrans.Microw.Theory Techn. ,vol.66,no.12,pp.5280–5289,Dec.2018.] By using a square patch resonator, starting from the field distribution of the degenerate mode on the square patch resonator, successfully designed a Balanced power divider filter with square patch resonator, but still unable to achieve dual frequency response

Method used

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  • Dual-passband balance power division filter adopting double-layer circular patches
  • Dual-passband balance power division filter adopting double-layer circular patches
  • Dual-passband balance power division filter adopting double-layer circular patches

Examples

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Embodiment 1

[0051] Figure 1~3 Embodiment 1 of the present invention is shown. This embodiment provides a dual-passband balanced power division filter using a double-layer circular patch, including an upper dielectric substrate 200 and a lower dielectric substrate 400. The upper dielectric substrate 200 and the lower dielectric substrate 400 are provided with a metal ground plate 300,

[0052] The upper surface of the upper dielectric substrate 200 is provided with a top-layer circular patch 10, a first input port feeder 1, a second input port feeder 2, a first isolation port 3 on the top layer, and a second isolation port 4 on the top layer. The patch 10 is located at the center of the upper dielectric substrate 200, one end of the first input port feeder 1 is connected to the edge of the upper dielectric substrate 200, and the other end is connected to the semicircle of the top circular patch 10; one end of the second input port feeder 2 It is connected to the edge of the upper layer d...

Embodiment 2

[0076] Figure 5 A modification of Embodiment 1 is shown as Embodiment 2 of the present application. Such as Figure 5 As shown, based on Embodiment 1, four rectangles are dug out from the upper dielectric substrate 200 on both sides of the first line segment AB and on both sides of the second line segment CD. The lower dielectric substrate 400 digs out two rectangles on both sides of the diagonal line EG. Two rectangles are dug out on the sides respectively, and the long sides of the rectangles lean against the edge of the metal grounding plate 300 and extend to the inside of the metal grounding plate 300; the dimensions of the above rectangles are the same.

[0077] Digging out four rectangles on the upper dielectric substrate 200 is convenient for placing four output SMA (SubMiniatureversion A) interfaces. The four output SMA interfaces are respectively connected to the first output port feeder 5, the second output port feeder 6, and the third output port feeder. 7 is co...

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Abstract

The invention discloses a dual-passband balanced power dividing filter adopting double-layer circular patches. The filter comprises an upper dielectric substrate and a lower dielectric substrate, and is characterized in that a metal grounding plate is arranged between the upper dielectric substrate and the lower dielectric substrate; the top layer circular patch, a first input port feeder line, a second input port feeder line, a top layer first isolation port and a top layer second isolation port are arranged on the upper surface of the upper layer dielectric substrate; the lower surface of the lower dielectric substrate is provided with the bottom circular patch, a first output port feeder line, a second output port feeder line, a third output port feeder line and a fourth output port feeder line; and the metal grounding plate is provided with a slot line which is used for transmitting the resonance mode of the top circular patch to the bottom circular patch. The dual-passband balanced power dividing filter has very small size and more perfect functions, can be realized on a single PCB (Printed Circuit Board), is convenient to process and integrate, and has high common-mode rejection performance.

Description

technical field [0001] The invention relates to the technical field of microwave passive devices, in particular to a dual-frequency balanced power division filter. Background technique [0002] With the development of modern communication systems, microwave devices have been widely used. Among them, compared with traditional single-ended devices, balanced components have the advantages of strong anti-interference ability and high reliability, and are one of the most critical devices. Balanced passive components such as balanced bandpass filters and balanced power splitters are also widely used, but simple cascading of the two will result in too large a volume, and balanced power splitters emerge as the times require, while dual-passband balanced Due to the characteristic of transmitting signals in two passbands, the power divider filter has received extensive attention. At the same time, compared with traditional microstrip lines and substrate integrated waveguide (SIW) st...

Claims

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Application Information

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IPC IPC(8): H01P1/203
CPCH01P1/203
Inventor 张钢张其运李威刘郑康焦飞
Owner NANJING IND INST FOR ADVANCED INTELLIGENT EQUIP
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