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Laminate, method for producing same, method for producing composite laminate, and method for producing polymer film

A manufacturing method and laminated body technology, applied in the direction of plating of superimposed layers, printed circuit manufacturing, chemical instruments and methods, etc., can solve the problems of interlayer peeling and low adhesion

Pending Publication Date: 2021-09-07
ASAHI GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, the adhesion between the TFE-based polymer layer and the prepreg is low, and delamination between these layers tends to occur

Method used

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  • Laminate, method for producing same, method for producing composite laminate, and method for producing polymer film
  • Laminate, method for producing same, method for producing composite laminate, and method for producing polymer film
  • Laminate, method for producing same, method for producing composite laminate, and method for producing polymer film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0306] Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples.

[0307] 1. Preparation of Components and Components

[0308] [F Polymer]

[0309] F Polymer 1: A copolymer containing TFE-based units, NAH-based units, and PPVE-based units in the order of 98.0 mol%, 0.1 mol%, and 1.9 mol% (melting temperature: 300°C, melting temperature at 380°C Viscosity: 3×10 5 Pa s)

[0310] F Polymer 2: A copolymer without an oxygen-containing polar group containing TFE-based units and PPVE-based units in the order of 98.0 mol% and 2.0 mol% (melting temperature: 305°C, melting temperature at 380°C Viscosity: 3×10 5 Pa s)

[0311] F Polymer 3: A copolymer without functional groups containing TFE-based units and PPVE-based units in the order of 97.5 mol% and 2.5 mol% (melting temperature: 305°C, melt viscosity at 380°C: 3×10 5 Pa s)

[0312] [powder]

[0313] Powder 1: Powder composed of F polymer 1 (D50: 2.6 μm, D90: 7.1...

example 1

[0396] First, the dispersion liquid 1 is applied on the surface of the metal foil 1 in a roll-to-roll manner by a die coating method to form a liquid film. Thereafter, the metal foil 1 on which the liquid film was formed was passed through a drying oven at 120° C. for 30 minutes, and dried by heating. Thereafter, the dried film was heated at 380° C. for 15 minutes in a nitrogen furnace. Thereby, the laminated body 1 in which the F layer was formed on the surface of the metal foil 1 is produced.

example 2

[0397] (Example 2 (comparative example))

[0398] The laminated body 2 was manufactured in the same manner as in Example 1 except having changed the metal foil 1 into the metal foil 2.

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PUM

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Abstract

To provide: a laminate which has achieved uniform and high adhesion between a polymer layer and a metal foil layer; and a method for producing this laminate. A laminate according to the present invention comprises a metal foil layer and a polymer layer which is arranged on the surface of the metal foil layer so as to be in direct contact therewith, and which contains a tetrafluoroethylene-based polymer that has a melt viscosity of from 1 * 102 to 1 * 106 Pa.s at 380 DEG C. This laminate is configured such that: no silicon atom is present in the surface of the metal foil layer; or the ratio of nickel atoms detected in the surface of the metal foil layer by means of X ray fluorescence analysis is from 0.03% by mass to 0.25% by mass.

Description

technical field [0001] The present invention relates to a laminate having a predetermined polymer layer provided in direct contact on the surface of a predetermined metal foil layer, a method for producing the same, a method for producing a composite laminate, and a method for producing a polymer film. Background technique [0002] In printed wiring boards, in order to achieve a low dielectric constant, it is sometimes necessary to reduce the surface roughness of the copper foil or form a polymer layer with a low dielectric constant polymer. However, low-k polymers are generally less polar and have poor adhesion to other materials. In addition, since the surface smoothness of the copper foil with reduced surface roughness is too high, the anchoring effect of the polymer layer is difficult to generate, and the adhesiveness is poor. Therefore, it is difficult to achieve strong adhesion between a polymer layer comprising a low dielectric constant polymer and a low-roughened co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29D7/00B32B5/10B32B5/16C23C28/00C25D5/16B32B15/08B32B15/082B29C65/02C23C26/00H05K1/03B32B3/26
CPCB29C65/02B29D7/00B32B5/10B32B5/16B32B3/26B32B15/08B32B15/082C23C26/00C23C28/00C25D5/16H05K1/03B32B27/20B32B27/304H05K1/0366H05K3/285B32B2305/076B32B2457/08
Inventor 笠井涉山边敦美寺田达也细田朋也
Owner ASAHI GLASS CO LTD
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