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Wafer grinding equipment for research and development of high-side NMOSFET driver chip

A driver and chip technology, applied in the direction of grinding/polishing equipment, grinding machine tools, grinding tools, etc., can solve the problems of large limitations, edge chipping, fragmentation, increased time, etc., and achieve a wide range of applications and good stability of the wafer Effect

Active Publication Date: 2021-08-17
深圳国融智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For example, the Chinese patent discloses: wafer grinding equipment, publication number: CN111482865A, which carries and drives the wafer to rotate through the first shaft body of the vacuum chuck shaft mechanism, and the pressing part of the pressing mechanism abuts against the wafer to hold it Compressed on the first shaft body, the positioning part of the positioning mechanism can perform secondary positioning on the wafer before the pressing mechanism performs the pressing operation to ensure the concentricity of the wafer and the first shaft body, and the grinding machine of the grinding mechanism can move along the The axial and radial movement of the first shaft body enables the wafer grinding equipment to grind the outer peripheral surface of the wafer from top to bottom along the axial direction of the first shaft body (wafer), avoiding grinding wheel and wafer The contact area of ​​the round surface to be processed is too large, resulting in chipping and fragmentation of the wafer, while the conveying mechanism transfers the wafer between the storage unit and the first axis body, realizing fully automatic access and retrieval of the wafer. Positioning, pressing, and grinding process minimize manual intervention, ensure the stability of wafer processing, and improve wafer processing efficiency. However, the equipment has relatively large limitations in use and can only be used for wafers of the same size. For grinding, if the wafer specifications are different, the grinding equipment needs to be replaced, which increases the time required for grinding

Method used

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  • Wafer grinding equipment for research and development of high-side NMOSFET driver chip
  • Wafer grinding equipment for research and development of high-side NMOSFET driver chip
  • Wafer grinding equipment for research and development of high-side NMOSFET driver chip

Examples

Experimental program
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Effect test

Embodiment 1

[0034] Example 1, please refer to figure 1 , Figure 7 and Figure 8 , the present invention provides a technical scheme of wafer grinding equipment for research and development of high-side NMOSFET driver chips: including a workbench 11, a rectangular groove 12 is opened at the center of the end of the workbench 11, and a connecting rod 13 is fixedly installed on the side wall of the workbench 11, The end of the connecting rod 13 is fixed with the first motor 14, the end of the first motor 14 is fixed with the column sleeve 15, and the side of the column sleeve 15 away from the first motor 14 is fixed with the hydraulic rod 16, and the hydraulic rod 16 runs through the equipment Adjustment column 17 is arranged, and the side wall of workbench 11 is provided with first bar-shaped groove 18 and second bar-shaped groove 19, and second bar-shaped groove 19 is positioned at first bar-shaped groove 18 lower ends, and second bar-shaped groove 19 interior is provided with Same stru...

Embodiment 2

[0038] Example 2, please refer to Figure 6 and Figure 9 , On the basis of Embodiment 1, the surface of the adjustment column 17 is covered with an adjustment mechanism.

[0039] The adjustment mechanism includes a threaded sleeve 21. Two threaded sleeves 21 are arranged symmetrically with the midpoint of the adjustment column 17 as the center point, and the threads on the surfaces of the two threaded sleeves 21 are in opposite directions. Rotary cap 22 is fixedly installed on the upper part, and a turntable 23 is fixedly installed on the side of the hydraulic rod 16 away from the column sleeve 15. The side wall of the turntable 23 is evenly mixed and equidistantly provided with a card slot 24, and a fixed column 25 is arranged inside the card slot 24, and the fixed column The surface of 25 is covered with a grinding sleeve 26, the side of the turntable 23 away from the hydraulic rod 16 is fixedly installed with an extrusion column 27, and the end of the extrusion column 27 ...

Embodiment 3

[0041] Embodiment three, please refer to figure 2 , image 3 , Figure 4 and Figure 5 , On the basis of Embodiment 1, a shaking mechanism is provided inside the first bar-shaped groove 18 .

[0042] The rocking mechanism comprises a slide bar 41, the slide bar 41 is arranged inside the first strip groove 18, the side wall of the end of the slide bar 41 is fixedly equipped with a slide block 42, and the end of the slide block 42 is fixedly equipped with a first movable column 43, and the first movable column 43 is fixedly installed at the end of the slide bar 42. Movable column 43 surface activities are provided with arc bar 44, and arc bar 44 sidewalls are provided with arc groove 45, and first movable column 43 is located in the arc groove 45 inside that is positioned at upper end, and arc bar 44 side walls middle part There is a central column 46 inside, and the opposite side of the central column 46 is fixedly connected to the workbench 11. The surface of the first mov...

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Abstract

The invention discloses wafer grinding equipment for research and development of a high-side NMOSFET driver chip. The wafer grinding equipment comprises a workbench, a rectangular groove is formed in the center of the end part of the workbench, a connecting rod is fixedly mounted on the side wall of the workbench, a first motor is fixedly mounted at the end part of the connecting rod, and a column sleeve is fixedly mounted at the end part of the first motor; a hydraulic rod is fixedly mounted on the side, away from the first motor, of the column sleeve, an adjusting column penetrates through the interior of the hydraulic rod, a first strip-shaped groove and a second strip-shaped groove are formed in the side wall of the workbench, an adjusting mechanism sleeves the surface of the adjusting column and comprises threaded sleeves, and the two threaded sleeves are symmetrically arranged with the midpoint of the adjusting column as the center point; and the surfaces of the two threaded sleeves are opposite in thread direction, the threaded sleeves are arranged on the surface of the adjusting column in a sleeving mode, a rotating cap is fixedly installed at the end of the adjusting column, and a rotating disc is fixedly installed on the side, away from the column sleeves, of the hydraulic rod, so that when the equipment is used, the distance of grinding sleeves can be adjusted at will, the equipment is suitable for wafers of any size, and the application range is wider.

Description

technical field [0001] The present application relates to the technical field of wafer processing, and in particular to a wafer polishing equipment for research and development of high-side NMOSFET driver chips. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical monocrystalline silicon. After grinding, polishing and slicing, silicon wafers are formed, that is, wafers. At present, domestic wafer production lines are mainly 8 inches and 12 inches. The main processing methods of wafers are sheet processing and batch processing, that is, processing 1 piece at the same time. Or multiple wafers, as the semiconductor feature size becomes smaller and smaller, processing and measurement equipment become more and more advanced, resulting in new data characteristics in wafer proce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00B24B37/11B24B37/27B24B37/34B24B55/12
CPCB24B37/00B24B37/11B24B37/27B24B37/34B24B55/12
Inventor 杨跃瑾
Owner 深圳国融智能科技有限公司
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