Method and circuit board for selective resin plugging

Abstract

The invention is applicable to the technical field of circuit board manufacturing technology, and provides a method for selectively plugging holes with resin and a circuit board. The method for selectively plugging holes with resin includes: providing a circuit board with a first hole that does not require a resin plug hole and a second hole that requires a resin plug hole, the first hole neutralizing all the holes. The second holes are all plated with hole copper; the pattern is transferred to the circuit board, so that the board surface of the circuit board is covered by dry film and only the first area is exposed, and the first hole is located in the first hole. area; perform pattern plating on the first hole, so that a protruding part is formed on the board surface of the circuit board, and the protruding part is located in the first area and surrounds the opening of the first hole; Perform film stripping on the circuit board; perform resin plugging on the second hole. The invention also provides a circuit board. The invention can prevent the resin ink from penetrating into the through holes that do not need the resin plug holes, and avoid the abnormal quality.

Description

technical field [0001] The present invention relates to the technical field of circuit board manufacturing technology, in particular to a method for selectively plugging holes with resin and a circuit board. Background technique [0002] The resin plugging process can solve a series of problems that cannot be solved by using green oil plugging or pressing and filling resin. Therefore, in recent years, the resin plugging process has become more and more widely used in the circuit board industry, especially in some layers. Products with high height and thick board are more popular. In production practice, some customers require some through holes to be plugged and some of them not to be plugged in the same unit of the circuit board, which requires the use of selective resin plugging. [0003] The traditional method of selective resin plugging is roughly divided into two processes. The first process is: drilling for the first time → copper sinking plate electric → drawing and ...

AI Technical Summary

Problems solved by technology

[0005] The invention provides a method for selectively plugging holes with resin and a circuit board to solve the problem of uneven copper thickness on the surface of the circuit board in the traditional process, unclean etching of the outer layer circuit, poor consistency of line width and line spacing, and problems when When the distance between the via holes that require resin plug holes and the via holes that do not require resin plug holes is small, the resin ink will easily penetrate into the via holes that do not require resin plug holes during the resin plugging process, resulting in abnormal quality problems

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