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Processing and production equipment and processing method for packaging substrate

A technology for packaging substrates and production equipment, which is applied in the manufacturing of electrical components, circuits, semiconductors/solid-state devices, etc., and can solve the problems of batch processing of substrates that cannot be packaged, harm to workers in pickling solution, and inability to meet the needs of use. material efficiency, avoid hazards, and ensure the effect of usability

Active Publication Date: 2021-10-01
深圳和美精艺半导体科技股份有限公司
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AI Technical Summary

Problems solved by technology

[0003] At present, the processing of packaging substrates requires repeated operations such as pickling, rinsing with clean water, and drying. Conventional packaging substrate processing equipment has a low degree of automation, and staff are required to manually pickle and load the packaging substrates. Batch processing and pickling liquid is easy to cause harm to the staff, which can no longer meet the needs of use

Method used

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  • Processing and production equipment and processing method for packaging substrate
  • Processing and production equipment and processing method for packaging substrate
  • Processing and production equipment and processing method for packaging substrate

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Embodiment Construction

[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0046] see Figure 1-12 , a processing and production equipment and processing method for packaging substrates, including a substrate body and a body 1 for automatically loading, pickling, washing with clean water and drying operations on the substrate body, a conveying mechanism 2, a lifting mechanism 3, an upper Material mechanism 4, drainage mechanism 5, wiping mechanism 6, pipeline mechanism 7 and drying mechanism 8, the substrate body includes a ceramic s...

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Abstract

The invention discloses processing and production equipment and a processing method for packaging substrates, and relates to the technical field of packaging substrate processing. Including the substrate body and the body for automatic loading, pickling, water rinsing and drying operations on the substrate body, conveying mechanism, lifting mechanism, feeding mechanism, drainage mechanism, wiping mechanism, pipeline mechanism and drying mechanism , the substrate body includes a ceramic substrate, and the inner layer thick copper foil and the outer layer thin copper foil are sequentially arranged on both sides of the ceramic substrate. By setting up the machine body, conveying mechanism, lifting mechanism and feeding mechanism, the substrate body to be pickled is automatically loaded through the conveying roller, and the substrate body is pickled, wiped and dried with the left and right movable loading rack. Compared with the conventional manual feeding method, it not only ensures the feeding efficiency of the substrate body, but also avoids the harm of the pickling solution to the staff, and ensures the usability of the device.

Description

technical field [0001] The invention relates to the technical field of packaging substrate processing, in particular to a processing production equipment and a processing method of a packaging substrate. Background technique [0002] The packaging substrate can provide electrical connection, protection, support, heat dissipation, assembly and other functions for the chip to achieve multi-pin, reduce the volume of packaged products, improve electrical performance and heat dissipation, ultra-high density or multi-chip modularization. Packaging substrates should be an interdisciplinary technology, which involves knowledge of electronics, physics, and chemical engineering. [0003] At present, the processing of packaging substrates requires repeated operations such as pickling, rinsing with clean water, and drying. Conventional packaging substrate processing equipment has a low degree of automation, and staff are required to manually pickle and load the packaging substrates. Ba...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L21/67
CPCH01L21/48H01L21/67034H01L21/67051H01L21/67057
Inventor 何福权
Owner 深圳和美精艺半导体科技股份有限公司
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