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Infrared sensor

An infrared sensing and sensor technology, applied in the field of infrared sensors, can solve the problems of complex packaging procedures, high packaging costs, damage to anti-reflection layers, etc., and achieve the effects of simplifying packaging procedures, reducing cost and volume

Pending Publication Date: 2021-08-06
TXC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the activation temperature of the getter exceeds 300°C, in order to prevent the infrared sensor chip and the anti-reflection layer of the infrared filter from being damaged by high temperature, the infrared sensor needs a special machine for the activation process of the getter, and the infrared sensor In order to form a vacuum chamber, the detector also needs to add an exhaust pipe to extract air, so the packaging cost of the traditional infrared sensor is relatively high, and the packaging process is also relatively complicated
In addition, the traditional infrared sensor requires an infrared filter and a lens, which also increases the cost and volume of the infrared sensor

Method used

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Embodiment Construction

[0033] figure 1 A cross-sectional view of the first embodiment of the infrared sensor of the present invention is shown. The infrared sensor 30 includes a substrate 32 , an infrared sensing chip 34 , a solder sheet 36 , a getter 38 , a metal cover 40 , a solder sheet 42 and an infrared lens 44 . The substrate 32 may be, but is not limited to, a ceramic substrate or a metal substrate. exist figure 1 In the embodiment, the substrate 32 is a leadless chip carrier (LCC), but the present invention is not limited thereto. The base plate 32 has an annular protrusion 322 . The infrared sensing chip 34 is fixed on the substrate 32 and surrounded by the ring-shaped protruding portion 322 . The infrared sensing chip 34 is used for sensing infrared light to generate a sensing image. The solder piece 36 is located between the annular protruding portion 322 and the metal cover 40 for fixing the metal cover 40 on the annular protruding portion 322 of the substrate 32 . The solder piece ...

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Abstract

According to the infrared sensor provided by the invention, the infrared lens with an infrared filtering function and a focusing function is used, so that an infrared filter can be omitted, and the cost and the size are reduced. Moreover, the infrared sensor can activate the getter on the inner side of the metal cover when the metal cover is welded to the substrate, so that the packaging procedure of the infrared sensor can be simplified.

Description

technical field [0001] The invention relates to an infrared sensor, in particular to an infrared sensor integrating an infrared lens. Background technique [0002] With the rapid progress of the semiconductor industry and electronic technology, the manufacturing technology of infrared sensors is also improving day by day. Infrared sensors can not only be used in medicine to measure body temperature, but also can be used in science, business and military, such as laser detection, missile guidance, infrared spectrometer, remote control, anti-theft device, thermal image reconnaissance, etc. superior. The infrared sensors can be mainly divided into two categories: thermal and photon. Since thermal infrared sensors are more convenient to use, they are widely used in general. Current thermal infrared sensors use an infrared sensing chip to sense infrared light to generate sensing images, and use a vacuum chamber to increase the sensitivity of the infrared sensing chip. A gette...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/101H01L31/0203H01L31/0232
CPCH01L31/101H01L31/0203H01L31/02327G01J5/20G01J5/045G01J5/0806G01J5/068
Inventor 李宗昇罗振玮翁家豪林俊其许庭钧游蕙柔林益宏林松纮
Owner TXC CORP
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