A dry adhesion mechanism based on belt-driven wedge-shaped bristle bundles

Abstract

The invention discloses a dry adhesion mechanism based on belt-driven wedge-shaped bristle bundles, and relates to the technical field of adhesion mechanisms, including a supporting outer frame, a wedge-shaped bristle bundle unit, a belt-driven tangential loading unit, a transmission unit, a displacement-force conversion unit and a normal Drive unit; the wedge-shaped bristle bundle unit contacts and adheres to the target, one end of the transmission unit is connected with the wedge-shaped bristle bundle unit, the other end is connected with the displacement-force conversion unit, and the transmission unit is also connected with the normal drive unit; the normal drive unit generates the driving displacement and driving force, the transmission unit is used to convert the driving displacement and driving force into the tension in the transmission unit, and the transmission unit transmits the tension to the wedge-shaped bristle bundle unit; the belt-driven tangential loading unit is located above the wedge-shaped bristle bundle unit, supporting tangential Load and unload. The invention realizes the stable tangential loading and unloading of the wedge-shaped bristle bundle, reduces the difficulty of mechanism manufacture, increases the feasibility, and meets the reliable and stable picking application requirements of flexible circuit boards, flexible films, and the like.

Description

technical field [0001] The invention relates to the technical field of adhesion mechanisms, in particular to a dry adhesion mechanism based on belt-driven wedge-shaped bristle bundles. Background technique [0002] Flexible devices such as electronic skins, flexible screens, wearable devices, and flexible semiconductor devices have become the trend of today's technological development. In various flexible devices, different flexible materials are used as components, and film materials and flexible circuit boards are commonly used forms. For example, in the process of manufacturing and assembling flexible display devices, organic polymer flexible films are often used Used as a substrate; flexible circuit boards are widely used due to their light weight, thin thickness and flexible application. Therefore, how to achieve stable and non-destructive operation of flexible circuit boards and reliable pickup of flexible films has become a hot research direction. [0003] Tradition...

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Problems solved by technology

However, it was also found in the research that since the loading method of the tendon wire is point contact loading, and there are inevitably assembly errors in practice, it is easy to introduce interference such as out-of-plane torque and peeling torque, resulting in poor operational stability of the adhesion device; The method can only move in a very rigid straight line, and the surface of the object to be picked up is often not absolutely horizontal. In addition to the manufacturing error and assembly error of the bristle itself, it is difficult to ensure the flatness of the bristle bundle and the surface of the target object, and the limit function of the linear guide rail. It also weakens the adaptability of the mechanism, often resulting in insufficient bonding area between the bristles and the target surface, which greatly affects the adhesion performance

[0006] Generally speaking, the traditional planar pick-up is almost all rigid base bristle bundles, and there are few schemes that use flexible base bristle bundles for planar pick-up, so the adaptability of pick-up is still insufficient; and the traditional scheme requires machining accuracy, assembly The precision and control precision are high, and it is difficult to control the micro-displacement of loading; the transmission mechanism between the traditional power source and the bristle bundle is also relatively complicated, which increases the difficulty of mechanism design, limits the performance of the mechanism, and reduces the actual feasibility

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