Precise circuit manufacturing method and circuit board

Abstract

The invention discloses a manufacturing method of a precise circuit and a circuit board. The manufacturing method comprises the following steps: ablating a circuit groove on the surface of an insulating substrate by using laser; depositing a copper layer on the surface of the insulating base material and the circuit groove through chemical copper deposition; removing a copper layer on the surface of the insulating base material through a grinding plate; and then depositing a nickel layer on the copper layer of the circuit groove through chemical nickel deposition, so that the circuit groove is filled and leveled up, the surface of the circuit is flattened through grinding, and the precise circuit is manufactured. According to the method, the technological process is optimized, the processes of film drying, exposure, developing, liquid medicine etching, copper plating and the like are omitted, the ultra-precise circuit with the circuit and the line distance smaller than 30 microns can be manufactured, meanwhile, the production process is optimized, and the production efficiency and the yield of finished products are improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for manufacturing a precision circuit and a circuit board. Background technique [0002] The 21st century has entered a highly information-based society, and the demand for information consumption is becoming more and more vigorous. High-speed, high-performance, and thinner and smaller are the mainstream development trends of future electronic products. Microelectronic packaging technology is also developing at a high speed, making it lighter and lighter. There are more and more applications of devices with thinner and higher packaging density, which prompts the circuit board as a supporting platform for electronic components to change to the direction of high density, high integration and miniaturization; therefore, the wiring density of circuit boards is becoming more and more precise. The line width and spacing are gradually developing in t...

AI Technical Summary

Problems solved by technology

[0004] The wiring technology of traditional electronic circuits is mainly based on the subtractive method and semi-additive method, while both SAP (semi-additive method) and m-SAP (improved SAP method) need to use chemical copper, flash etching, electroplating, micro-etching, etc. Wet technology, the use of chemical etching method will inevitably have the problem of side erosion, the size of the side erosion is closely related to the thickness of the copper, and the thickness of the bottom copper is less than 12μm, and it will be difficult to manufacture and press the copper foil; and to increase The bonding force between the copper foil and the base material adopts the method of roughening the surface of the copper foil and the surface of the resin, which will increase the processing cost, and the roughened surface will have a bad influence on the transmission of the signal; the above process steps also have complex procedures, High energy consumption, high cost and serious environmental pollution

[0005] In addition, because the thickness of copper on the surface of the printed circuit board is generally required to be greater than 25 microns, at the same time, affected by factors such as the uniformity of electroplating copper, the development accuracy of the dry film, the alignment exposure accuracy, the uniformity of etching, and side etching, traditional printing The wire width and the spacing between wires obtained by the manufacturing method of the circuit board circuit are generally controlled above 30 μm / 30 μm (line width / spacing), and as the line width and line spacing are smaller and the density is higher, the production cost of the product is higher. The lower the pass rate, it is difficult to produce ultra-precision circuits with line width / spacing less than 30μm / 30μm, such as ultra-high-density circuits such as 20μm / 20μm, 10μm / 10μm, etc. It is difficult to manufacture more precise circuits using traditional methods However, the method of printing with high-performance conductive nano-conductive ink has the problems of difficult material preparation and extremely low production efficiency

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