Sorting equipment for chip production

Abstract

The invention relates to sorting equipment for chip production. The sorting equipment comprises a workbench, a top plate, a suction pump, a connecting pipe, a suction cup, a first branch pipe, a second branch pipe and two fixing rods, and further comprises a dust removal mechanism and a fixing mechanism. The dust removal mechanism comprises a motor, a first gear, a second gear, a first through pipe, a second through pipe, a dust removal assembly, a first bearing, a rotating pipe, two limiting assemblies and two nozzles, and the fixing mechanism comprises a rotating shaft, a first bevel gear, a second bevel gear, two first bearings and two fixing assemblies. According to the sorting equipment for chip production, through the dust removal mechanism, the dust removal function of chips is achieved, the situation that dust attached to the chips increases a gap when the suction cup abuts against the chips is avoided, the phenomenon of air leakage is avoided, and the situation that the adsorption effect is affected is avoided; and through the fixing mechanism, the function that the connecting pipe can be clamped when the chips are adsorbed is achieved, and the situation that when the chips are adsorbed, a gap is formed between the connecting pipe and the second branch pipe is avoided, so that the phenomenon of air leakage is avoided.

Description

technical field [0001] The invention relates to the field of chips, in particular to a sorting device for chip production. Background technique [0002] The chip is to cut wafers of different sizes into predetermined sizes. In order not to mess up the cut semiconductor chips during cutting, the wafer is bonded with an adhesive holding tape on the back side, and the wafer is cut from the front side by a wafer cutting device, etc. At this time, Although the holding tape glued on the back is cut into several pieces, it is not cut off and becomes the state of holding each semiconductor chip. The chip is removed from the holding tape and placed in the chip carrier for subsequent assembly. This process is called chip sorting. Sorting will install electrical properties to separate the chips into good and bad or into different grades. [0003] When the existing chip sorting equipment uses the suction cup to absorb chips for a long time, the suction cup is prone to aging, which is e...

AI Technical Summary

Problems solved by technology

[0003] When the existing chip sorting equipment uses the suction cup to absorb chips for a long time, the suction cup is prone to aging, which is easy to cause air leakage, which affects the adsorption work of the suction cup. Not only that, the existing chip sorting equipment is in When absorbing the chip, there will be debris on the chip. If it is not cleaned in time, the gap between the suction cup and the chip will be increased, so that the suction cup cannot absorb the chip, affecting the normal sorting work, thereby reducing the existing chips. Reliability of sorting equipment

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