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Etching solution composition and etching method for copper-molybdenum alloy

A technology of copper-molybdenum alloy and etching solution, which is applied in the field of electronic chemicals, can solve the problems of weakened acidity of the etching system, enhanced alkalinity, and high cost of sewage treatment of phosphorus-containing components, and achieve the effect of improving the consumption of organic acids

Active Publication Date: 2021-06-25
四川江化微电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] There are the following technical defects in actual production: First, the content of fluoride ions and organic bases is not easy to control. The oxidizing agent such as hydrogen peroxide in the etching system oxidizes the alloy to form corresponding oxides, and the acid participates in dissolving oxides to form metal ions. Consumption, the acidity of the etching system is weakened and the alkalinity is strengthened, which is easy to cause molybdenum or molybdenum alloy undercut
The existing method to solve the above-mentioned undercut problem is to add organic phosphorus or inorganic phosphorus in the etching solution composition, but the cost of sewage treatment of phosphorus-containing components is high; the second, fluoride ions will also cause the panel transparent electrode material ITO / IGZO ( Indium tin oxide / indium gallium zinc oxide) and substrate damage

Method used

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  • Etching solution composition and etching method for copper-molybdenum alloy
  • Etching solution composition and etching method for copper-molybdenum alloy
  • Etching solution composition and etching method for copper-molybdenum alloy

Examples

Experimental program
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Effect test

Embodiment 1-3

[0032] The composition of embodiment 1-3 and comparative example 1-3 sees the table below, and composition is all in weight percentage in the table:

[0033]

[0034]

[0035] The detection result of embodiment 1-3 and comparative example 1-2 sees the following table:

[0036] Solution life etch tilt angle cd loss Example 1 9500ppm 40.1° 0.85μm Example 2 9800ppm 40.4° 0.80μm Example 3 10000ppm 38.9° 0.88μm Comparative example 1 9400ppm 54.0° 1.09μm Comparative example 2 9700ppm 53.2° 1.05μm

[0037] As can be seen from the above table, Example 3 and Comparative Example 1 form a comparison containing sterically hindered amines in the organic base, and the sterically hindered amines help to reduce the cd loss. In Example 2, all organic bases are sterically hindered amines, and the mass The percentage increases to 6.5%, and the cdloss is further reduced on the basis of Example 1 and Example 3. In contrast...

Embodiment 4-6

[0039] The composition of embodiment 4-6 and comparative example 3-5 sees the table below, and composition is all in weight percentage in the table:

[0040]

[0041]

[0042] In the above table, H 2 o 2 The weight percent of is calculated as the weight percent of hydrogen peroxide. The difference between embodiment 4-6 and comparative example 3-5 is that the composition of organic acid is different, and organic base all adopts the combination of isopropanolamine and tert-butylaminoethoxyethanol, and the weight of isopropanolamine in the etchant composition Percentage is 1.25%, and the weight percent of tert-butylaminoethoxyethanol is 3.75% (organic base total amount 100%, the weight percent of isopropanolamine is 25%, the weight percent of tert-butylaminoethoxyethanol is 75% %).

[0043] The detection result of embodiment 4-6 and comparative example 3-5 sees the following table:

[0044] Solution life etch tilt angle cd loss Molybdenum layer remains...

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Abstract

The invention discloses a copper-molybdenum alloy etching liquid composition. The copper-molybdenum alloy etching liquid composition mainly comprises, by weight, 5%-12% of hydrogen peroxide, 5%-10% of organic acid, 5%-10% of organic alkali and 0%-0.5% of etching inhibitor. The organic alkali is steric hindrance amine or the main composition of the organic alkali comprises the steric hindrance amine, and the pKa of the steric hindrance amine is 10.3-11.1 at the temperature being 25 DEG C. The steric hindrance amine is adopted for etching liquid composition of the copper-molybdenum alloy as the organic alkali, or the organic alkali mainly comprises the steric hindrance amine, and by utilizing the steric hindrance of a molecular structure of the organic alkali, in an etching system without fluorine ions and phosphorus components, the problem of molybdenum or molybdenum alloy undercutting caused by organic acid consumption and alkalinity enhancement fluctuation in the later reaction stage is solved. The invention further discloses an etching method of the etching solution composition based on the copper-molybdenum alloy.

Description

technical field [0001] The invention relates to the technical field of electronic chemicals, in particular to an etching solution composition and an etching method for a copper-molybdenum alloy. Background technique [0002] In high-generation display panels, copper wires have the characteristics of low impedance, which can meet the production requirements of high-hertz products. The basic components of the acidic etching solution for copper and its alloys in the prior art include oxidizing agents such as hydrogen peroxide, organic bases, and etching solution inhibitors. Adding fluoride ions to the above etching solution can improve the etching effect, better remove molybdenum or molybdenum alloy, and reduce molybdenum residue. [0003] There are the following technical defects in actual production: First, the content of fluoride ions and organic bases is not easy to control. The oxidizing agent such as hydrogen peroxide in the etching system oxidizes the alloy to form corr...

Claims

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Application Information

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IPC IPC(8): C23F1/18C23F1/26C23F1/34C23F1/38C23F1/44
CPCC23F1/18C23F1/26C23F1/34C23F1/38C23F1/44
Inventor 邵勇徐杨朱永刚顾维忠彭聪胡生望
Owner 四川江化微电子材料有限公司
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