Monolithic and system-level circuit integrated package structure of terahertz microstrip probe without jumper

Abstract

The invention discloses a terahertz jumper-free microstrip probe monolithic and system-level circuit integrated packaging structure, which is applied to the technical field of circuit packaging. The problem is that the present invention punches holes in the Pi dielectric layer above each chip pad to make a hole-shaped interconnection structure, so that the test pad is connected to the microstrip line without the traditional gold wire bonding jumper structure, and the microstrip line and the interconnection match the microstrip line. The stub connection is used to correct the impedance mismatch introduced by the hole-shaped interconnection structure. Since the hole-shaped interconnection structure and the interconnect matching microstrip stubs are made by high-precision metal atom sputtering technology, good consistency and repeatability can be guaranteed.

Description

technical field [0001] The invention belongs to the technical field of circuit packaging, and in particular relates to a terahertz monolithic and system-level circuit technology. Background technique [0002] Terahertz waves in a broad sense refer to electromagnetic waves with frequencies ranging from 100GHz to 10THz (corresponding to wavelengths of 3mm to 30um). Because terahertz waves are located in the transition zone between macroelectronics and microphotonics, they have many unique properties. Compared with microwave and millimeter waves, terahertz waves have the characteristics of high frequency and short wavelength. Therefore, terahertz waves have stronger beam directivity, higher resolution, and larger information capacity, and electronic equipment can be made smaller. Compared with light waves, terahertz waves are more penetrating and can be used in environments such as rain, fog, and smoke-filled battlefields, and have all-weather working capabilities; terahertz wa...

AI Technical Summary

Problems solved by technology

There are many forms of conversion between rectangular waveguide and planar transmission line. The commonly used ones are mainly waveguide-ridge waveguide-microstrip transition, waveguide-microstrip probe transition and waveguide-probe-microstrip transition. These traditional microwave transition structures are difficult to integrate with on-chip circuits. The test pads (pads) are directly interconnected, and in the millimeter wave and terahertz frequency bands, after interconnection with gold wire bonding wires, high transmission loss will be introduced, and good repeatability and consistency cannot be guaranteed.

Images