Terahertz Jumperless Inverted Coplanar Waveguide Monolithic Circuit Packaging Transition Structure

Abstract

The invention discloses a terahertz jumper-free inverted coplanar waveguide monolithic circuit package transition structure, which is characterized in that it includes a lower cavity, an upper cavity and a coplanar waveguide circuit, and the upper cavity is sealed on the lower cavity. The rectangular waveguide cavity, the coplanar waveguide circuit shielding cavity and the monolithic circuit shielding cavity connected in sequence, the monolithic circuit is installed in the monolithic circuit shielding cavity, the coplanar waveguide circuit is installed in the coplanar waveguide circuit shielding cavity, and the coplanar waveguide circuit Connected to a monolithic circuit; a terahertz jumperless inverted coplanar waveguide monolithic circuit packaging transition structure provided by the present invention can reduce the energy loss of the chip packaging structure in the terahertz frequency band, improve packaging performance, and reduce process complexity and cost, simple structure, convenient design and manufacture.

Description

technical field [0001] The invention belongs to the field of monolithic circuit packaging technology and terahertz device technology, and in particular relates to a transitional structure of a terahertz jumper-free inverted coplanar waveguide monolithic circuit packaging. Background technique [0002] Terahertz covers a wide spectrum range from 100GHz to 10THz, with a wavelength range of 3 mm to 30 microns, and has some characteristics of microwave and infrared. Its spectral range is wider than that of microwaves, the information capacity is increased, and it is suitable for high-speed and large-capacity communication; the signal-to-noise ratio of terahertz radiation is high, and it is suitable for high-quality imaging; its radiation energy is small, and it can penetrate ceramics, fabrics, plastics, and fats. and other materials, the attenuation is small. Terahertz monolithic circuits include terahertz amplifiers, frequency multipliers, mixers, signal transceiver systems, e...

AI Technical Summary

Problems solved by technology

There are many forms of conversion between rectangular waveguide and planar transmission line. The commonly used ones are mainly waveguide-ridge waveguide-microstrip transition, waveguide-microstrip probe transition and waveguide-probe-microstrip transition. These traditional microwave transition structures are difficult to integrate with on-chip circuits. The probe test structures (pads) are directly interconnected

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