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Ceramic vapor chamber structure provided with fins and based on tape casting method and manufacturing method of ceramic vapor chamber structure

A production method and technology of soaking plates, which are applied in heat exchange equipment, indirect heat exchangers, lighting and heating equipment, etc., can solve problems such as poor heat soaking performance and poor thermal conductivity, and achieve improved working fluid reflux capacity, Optimize the packaging structure and enhance the effect of heat dissipation

Pending Publication Date: 2021-06-18
SOUTH CHINA UNIV OF TECH
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0007] The first technical problem to be solved in this application is to provide a ceramic vapor chamber structure with fins based on the tape casting method to solve the technical problems of poor thermal conductivity and poor heat uniformity of the existing vapor chamber structure

Method used

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  • Ceramic vapor chamber structure provided with fins and based on tape casting method and manufacturing method of ceramic vapor chamber structure
  • Ceramic vapor chamber structure provided with fins and based on tape casting method and manufacturing method of ceramic vapor chamber structure
  • Ceramic vapor chamber structure provided with fins and based on tape casting method and manufacturing method of ceramic vapor chamber structure

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Embodiment Construction

[0040] Such as Figure 1 ~ 5 As shown, a ceramic heated plate structure having fins with fins, including a heated plate, fins 2, and a working fluid, a heating plate comprising upper plate 3 and a lower plate body 1, a plate body There is a chamber between the 3 and the lower plate body 1, and the intermediate forming chamber is easy to evacuate and inject the dielectric fluid. The hot plate is designed as a quadrilateral, circular or trapezoid according to the required heat transfer shape.

[0041] The upper plate body 3 body has a plurality of fins 2, and the specific fins 2 shape can process the regular geometrics, cylinders, cones, spirals, etc. of the wax mold, can be machined in the wax mold, can also be complex by machining and molding methods. The three-dimensional geometry is formed into a fin 2 inverse shape, and then wip the inversion of the inversion of the casting, and the fin 2 is obtained after solidification. Both the upper surface of the upper plate 3 and the lower...

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Abstract

The invention provides a ceramic vapor chamber structure provided with fins and based on a tape casting method. The ceramic vapor chamber structure comprises a vapor chamber, the fins and working medium fluid. The vapor chamber comprises an upper plate body and a lower plate body, a cavity is arranged between the upper plate body and the lower plate body, the multiple fins are uniformly distributed on the body outer side of the upper plate body, multiple channels are arranged on the bottom face of the upper plate body and the top face of the lower plate body, and the channels on the upper plate body and the lower plate body are arranged side by side. The working medium fluid is sealed in the cavity. The vapor chamber structure can solve the technical problems that an existing vapor chamber structure is poor in heat conduction capacity and poor in vapor chamber performance.

Description

Technical field [0001] The present invention relates to the field of ceramic heating plate technology, and more particularly to a ceramic heated plate structure with fins with fins and its production methods. Background technique [0002] With the rapid development of third-generation semiconductors, the power semiconductor device is rapidly developed to high power, miniaturization and multi-function, but as system integration continues to increase, its power density has increased rapidly, and system function integration leads to The heat distribution is uneven. The original conventional package technology cannot meet the requirements of the third-generation semiconductor high temperature, high frequency and other characteristics. The ceramic substrate is an ideal component of a balance temperature and heat dissipation as a semiconductor package substrate. The ceramic substrate can also be attached for an electronic circuit. The heat dissipation of the electronic circuit can also...

Claims

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Application Information

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IPC IPC(8): F28D15/02F28F3/06
CPCF28D15/02F28F3/06
Inventor 汤勇袁雪鹏余彬海李宗涛颜才满余树东
Owner SOUTH CHINA UNIV OF TECH
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