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Laser cutting protection liquid as well as preparation method and application thereof

A laser cutting and protective liquid technology, applied in coatings, anti-corrosion coatings, fire-resistant coatings, etc., can solve problems such as internal structure damage, chip chipping, scratches, etc., to save equipment and material costs, and achieve excellent heat resistance. Effect

Pending Publication Date: 2021-06-04
深圳市化讯半导体材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, as the feature size of semiconductor integrated circuits continues to shrink, if a wafer with a low dielectric constant film (Low-k film) is cut by a traditional knife wheel, due to the brittleness of the Low-k material, there will be the following problems: scratches, Defects, etc., or the insulating film formed on the surface of the chip as a necessary circuit element peels off. Excessive stress can easily cause chipping and damage to the internal structure, and qualified products cannot be obtained.
However, it cannot meet the requirements of ultraviolet, green and infrared laser cutting at the same time

Method used

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  • Laser cutting protection liquid as well as preparation method and application thereof
  • Laser cutting protection liquid as well as preparation method and application thereof
  • Laser cutting protection liquid as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] The present embodiment provides a laser cutting protection solution, which includes the following components according to weight percentage: 20% water-soluble resin (polyvinylpyrrolidone, number average molecular weight 75000g / mol, purchased from BASF, the brand is Luvitec@ ), solvent 20% (diacetone alcohol), humectant 2% (propylene glycol), water-soluble UV absorber 0.5% (benzophenone-4-carboxylic acid), water-soluble antioxidant 0.25% (tannic acid) , water-soluble red pigment 5% (Food Red No. 105), pH regulator 1.5% (ethanolamine), anti-corrosion agent 0.15% (benzotriazole) and water 50.6%.

[0063] The preparation method of above-mentioned laser protective liquid is as follows:

[0064] Stir and mix the water-soluble resin, solvent and humectant in water according to the weight percentage, then add the water-soluble antioxidant, water-soluble red pigment and anti-corrosion agent according to the weight percentage, add the pH regulator according to the weight percenta...

Embodiment 2

[0066] This embodiment provides a laser cutting protection solution, which includes the following components according to weight percentage: 10% water-soluble resin (polyvinyl alcohol, number average molecular weight 60000g / mol, purchased from Chuanwei, the brand is 2488 ), solvent 5% (ethylene glycol butyl ether), humectant 0.5% (polyethylene glycol, number average molecular weight is 400g / mol, purchased from Dow Chemical, trade mark is PEG-400), water-soluble ultraviolet absorber 0.1 % (benzophenone-4,4-dicarboxylic acid), water-soluble antioxidant 0.1% (sodium sulfite), water-soluble red pigment 2% (erythrosine), pH regulator 1% (acetic acid), corrosion inhibitor 0.1% (mercaptobenzothiazole) and water 81.2%.

[0067] The preparation method of above-mentioned laser protective liquid is as follows:

[0068] Stir and mix the water-soluble resin, solvent and humectant in water according to the weight percentage, then add the water-soluble antioxidant, water-soluble red pigment...

Embodiment 3

[0070] The present embodiment provides a laser cutting protection solution, which comprises the following components according to weight percentage: 3% water-soluble resin (hydroxypropyl cellulose, number average molecular weight 90000g / mol, purchased from Dow, trade name METHOCEL K100MP), 30% solvent (ethylene glycol butyl ether and ethylene glycol tert-butyl ether with a mass ratio of 1:1), 5% humectant (dipropylene glycol and diethylene glycol with a mass ratio of 2:1), Water-soluble UV absorber 1% (2,7-anthraquinone disulfonic acid sodium salt), water-soluble antioxidant 0.5% (sodium sulfite), water-soluble red pigment 10% (carmine), pH regulator 2% (N , N-dimethylcyclohexylamine), 0.2% of corrosion inhibitor (benzothiazole and ATMP with a mass ratio of 1:1) and 48.3% of water.

[0071] The preparation method of above-mentioned laser protective liquid is as follows:

[0072]Stir and mix the water-soluble resin, solvent and humectant in water according to the weight percen...

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Abstract

The invention relates to a laser cutting protection liquid as well as a preparation method and application thereof, and the laser cutting protection liquid comprises the following components in percentage by weight: 1%-20% of water-soluble resin, 1%-30% of a solvent, 0.5%-5% of a humectant, 0.1%-1% of a water-soluble ultraviolet absorbent, 0.1%-0.5% of a water-soluble antioxidant, 2%-10% of a water-soluble red pigment, 1%-2% of a pH regulator, 0.1%-0.2% of an anticorrosive agent and the balance of water, totaling 100%; wherein the boiling point of the solvent is higher than 145 DEG C; the humectant comprises an alcohol containing two or more than two hydroxyl groups. The laser cutting protection liquid has excellent heat resistance, can adapt to various application requirements of laser cutting protection, and can save equipment and material cost.

Description

technical field [0001] The invention relates to the technical field of laser cutting, in particular to a laser cutting protective liquid and its preparation method and application. Background technique [0002] With the continuous expansion of the high-brightness LED market, the demand for improving production efficiency and product yield is rising. Therefore, laser ablation processing and invisible cutting methods have gradually become mainstream processes in high-brightness LED processing. Among them, laser ablation processing takes into account the balance of efficiency, pass rate and cost. Moreover, as the feature size of semiconductor integrated circuits continues to shrink, if a wafer with a low dielectric constant film (Low-k film) is cut by a traditional knife wheel, due to the brittleness of the Low-k material, there will be the following problems: scratches, Defects, etc., or the insulating film formed on the surface of the chip as a circuit element is peeled off....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D139/06C09D129/04C09D101/28C09D5/32C09D5/08C09D7/48C09D7/63
CPCC09D139/06C09D129/04C09D101/284C09D5/32C09D5/08C09D5/18C09D7/48C09D7/63C08L2201/08C08K5/09C08K5/3475C08K5/053
Inventor 黄明起夏建文易玉玺刘彬灿叶振文
Owner 深圳市化讯半导体材料有限公司
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