Addition process manufacturing process of fine circuit board

Abstract

The invention discloses an addition process manufacturing process of a fine circuit board, which comprises the following steps of immersing a base material into a micro-etching solution, and carrying out micro-etching treatment on the base material under the assistance of ultrasonic oscillation, placing the base material in a chemical copper plating solution for chemical copper plating, and acquiring a copper-clad base material, drilling a via hole in the copper-clad base material, depositing a conductive carbon layer on the via hole of the copper-clad base material, pasting a photosensitive dry film on the copper-clad base material, performing exposure and development treatment on the photosensitive dry film to obtain a groove of a fine circuit, forming a copper layer in the groove in an electroplating mode, and removing the dry film, and placing the copper-clad base material in a flash etching solution to be subjected to flash etching treatment. According to the process, the conductive carbon layer is adopted to realize the conduction between the conducting hole and the circuit, the copper circuit is directly formed by matching the pattern electroplating process with the flash etching process, the process is simple, the production cost is low, the production efficiency is high, the binding force between the copper circuit of the manufactured circuit board and the base material is high, and the product yield is high.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, in particular to an additive manufacturing process of fine circuit boards. Background technique [0002] With the continuous innovation and development of electronic products in the direction of multi-functionality and intelligence, higher requirements are put forward for the carrier printed circuit board carrying electronic parts, which in turn pushes the circuit board to be light, thin, short and small. develop. Therefore, circuit boards with denser and thinner circuits and a line width / spacing of 3mil / 3mil have gradually become products in regular demand; while circuit boards with 2.5mil or even 2mil circuits have been produced by enterprises and will gradually become a trend. For such a fine circuit, its production process becomes particularly important; a production process with high product yield and high production efficiency is the goal that many circuit board factories have been...

AI Technical Summary

Problems solved by technology

[0003] The production methods of circuit boards mainly include subtractive method and additive method; the traditional additive method process is: incoming material → chemical copper → primary copper plating → line pretreatment → dry film application → exposure → development → secondary copper plating → tin plating → film stripping → alkaline etching → tin stripping → washing → drying → post-process; the traditional additive method generally uses the chemical copper process to perform chemical copper plating on the via holes, which has low production efficiency and is easy to Pollution to the environment; in addition, the traditional additive process needs to undergo a copper plating and secondary copper plating process, and also requires tin plating and tin stripping operations, which makes the process complicated, high production cost, and low production efficiency; traditional The etching process of the additive method is an alkaline etching process, and the potions used are alkaline etching potions, such as ammonium bicarbonate and ammonium chloride, which not only have a long process, but also cause serious environmental pollution. The processing is difficult and increases the cost of post-processing

In addition, the bonding force between the copper circuit and the base material obtained by the traditional additive method is small, and it is easy to fall off, thereby reducing the yield rate