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A stacking device for semiconductor lead frames

A lead frame, semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, transportation and packaging, electrical components, etc., can solve the problems of labor consumption and low production efficiency, and achieve the effect of saving labor, reducing production costs, and improving safety.

Active Publication Date: 2021-06-25
四川旭茂微科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Most semiconductors use two lead frame models to overlap to form a package structure. Most of the existing lead frame stacking devices use an assembly line structure, using pads to transfer the bottom lead frame along the conveying line, then bonding the chip, and then stacking The top-level lead frame, this method needs to be manually put into the pads equipped with lead frames one by one, and then the stacked lead frames and pads are taken out one by one, the production efficiency is low, and it is very labor-intensive

Method used

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  • A stacking device for semiconductor lead frames
  • A stacking device for semiconductor lead frames
  • A stacking device for semiconductor lead frames

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Embodiment

[0048] Such as Figure 1 to Figure 7 As shown, a semiconductor lead frame stacking device includes: a first linear mechanism 100, a stacking mechanism 200, a pad buffer mechanism 300, a second linear mechanism 400, a third linear mechanism 500, a rotating mechanism 600 and a first Four linear mechanism 700.

[0049] Specifically, the first linear mechanism 100 has a stacking mechanism 200 at one end and a pad buffer mechanism 300 at the other end for stacking empty pads. One end of the stacking mechanism 200 is sequentially provided with a pad mounting station 110, a first assembly station 120, a second assembly station 130, and a finished product stacking station 140, and the stacking mechanism 200 is arranged above the finished product stacking station 140. The linear mechanism 100 is slidably provided with a running plate 150. The running plate 150 is used to install and transfer the pad 10. The top surface of the pad 10 is used to carry the bottom lead frame, correspondin...

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Abstract

The application provides a semiconductor lead frame stacking device, comprising: a first linear mechanism, a stacking mechanism is provided at one end, a pad buffer mechanism is provided at the other end, the first linear mechanism is provided with a pad mounting station, For the first assembly station, the second assembly station, and the finished product stacking station, the first linear mechanism slides and is provided with a transfer plate. The stacking mechanism is provided with four sets of rotating stops for supporting the pads, and the stacking mechanism is also provided with a pair of lifting plates. The second linear mechanism is provided with a first discharge station corresponding to the first assembly station, and a second discharge station is provided corresponding to the second assembly station. The third linear mechanism is provided with a bottom frame suction cup for transferring the bottom lead frame. The rotating mechanism is provided with a rotating suction cup for carrying the top lead frame. The fourth linear mechanism is provided with a top frame suction cup for transferring the top lead frame from the second discharge station to the rotary suction cup and overlapping the top lead frame on the bottom lead frame. Save manpower and improve production efficiency.

Description

technical field [0001] The invention belongs to the field of semiconductor lead frame assembly, in particular to a semiconductor lead frame stacking device. Background technique [0002] Most semiconductors use two lead frame models to overlap to form a package structure. Most of the existing lead frame stacking devices use an assembly line structure, using pads to transfer the bottom lead frame along the conveying line, then bonding the chip, and then stacking The top-layer lead frame, this method needs to be manually put into the pads with the lead frame one by one, and then the stacked lead frames and pads are taken out one by one, the production efficiency is low, and it is very labor-intensive. Contents of the invention [0003] In order to solve the deficiencies in the prior art, the present invention provides a stacking device for semiconductor lead frames. The pad buffer mechanism can place multiple empty pads at one time, avoiding placing one by one. The bottom le...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/683H01L21/687H01L21/67
CPCH01L21/67144H01L21/67742H01L21/67766H01L21/6838H01L21/68792
Inventor 王秋明贺国东赵文全温正萍邹佩纯赵雪
Owner 四川旭茂微科技有限公司
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