Adhesive film cutting device for wafer

Abstract

The invention discloses an adhesive film cutting device for a wafer. The adhesive film cutting device for the wafer structurally comprises a machine body, sliding blocks and a portal frame. Considering the problem that since the portal frame moves on the top of a cutting table and drives surrounding airflow to flow, the edge of an adhesive film is prone to floating upwards under the action of the airflow, a rotating ring in a limiting mechanism makes contact with the surface of the edge of the adhesive film along with movement of the portal frame, the rotating ring presses downwards and smooths the edge of the adhesive film, the phenomenon that the adhesive film on the edge of the cutting table floats upwards under the action of airflow is reduced, the phenomenon that the edge of the adhesive film is wrinkled is reduced, the cut shape of the adhesive film keeps unchanged beneficially, the adhesive film is matched with the surface size of a wafer, and the adhesive film can be normally used for covering the surface of the wafer. Considering the problem that since adhesive film fluid is attached to the outer wall of the rotating ring, the phenomenon that the adhesive film rotates along with the rotating ring under the action of adsorption force of the fluid is prone to happen, the adhesive film fluid on the outer wall of the rotating ring is removed through a scraping plate in a matching block, so that the outer wall of the rotating ring can be kept clean.

Description

technical field [0001] The invention belongs to the field of wafer coating, and more specifically relates to an adhesive film cutting device for wafers. Background technique [0002] After the wafer processing is completed, the product is covered with an adhesive film, which is beneficial to the protection of the wafer and reduces the phenomenon of scratches on the product surface during transportation. The adhesive film is cut into the same size as the product by a cutting machine. The film is placed horizontally on the cutting table of the cutting machine, the gantry and the sliding block move together to drive the cutter to move, and the laser of the cutter is irradiated on the surface of the film, so that the film is hot-melted and cut off; in the prior art, the film is cut by cutting machine When cutting, because the gantry moves on the top of the cutting table to drive the surrounding air flow, and the film is light in weight, when the gantry moves, the film on the edg...

AI Technical Summary

Problems solved by technology

[0002] After the wafer processing is completed, the product is covered with an adhesive film, which is beneficial to the protection of the wafer and reduces the phenomenon of scratches on the product surface during transportation. The adhesive film is cut into the same size as the product by a cutting machine. The film is placed horizontally on the cutting table of the cutting machine, the gantry and the sliding block move together to drive the cutter to move, and the laser of the cutter is irradiated on the surface of the film, so that the film is hot-melted and cut off; in the prior art, the film is cut by cutting machine When cutting, because the gantry moves on the top of the cutting table to drive the surrounding air flow, and the film is light in weight, when the gantry moves, the film on the edge of the cutting table will float up due to the air flow, and the edge of the film will be wrinkled. Phenomenon, when the adhesive film is cut, the shape of the adhesive film changes, which does not match the surface size of the wafer, and cannot be used to cover the surface of the wafer normally.

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