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Hot melt adhesive capable of being rapidly formed at low temperature and excellent in boiling resistance and preparation method thereof

A technology of hot-melt adhesives and formulations, applied in the direction of adhesives, etc., can solve the problems of poor boiling resistance, easy softening and falling off, high sizing temperature, etc., and achieve fast molding speed, excellent boiling resistance and low melting temperature. Effect

Active Publication Date: 2021-04-27
HUANGSHAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the current hot melt adhesive is a pure thermoplastic resin, in order to achieve its excellent bonding strength, its molecular weight needs to be prepared larger to achieve its stronger cohesion, which leads to a higher softening point and a higher sizing temperature. They are all at 160°C and above, and the cooling time after sizing is longer, usually more than 15 minutes to facilitate the complete cooling inside to achieve a relatively uniform effect, and it is easy to occur in the process of boiling water because it is a thermoplastic material. Soften and fall off, poor boiling resistance

Method used

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  • Hot melt adhesive capable of being rapidly formed at low temperature and excellent in boiling resistance and preparation method thereof
  • Hot melt adhesive capable of being rapidly formed at low temperature and excellent in boiling resistance and preparation method thereof
  • Hot melt adhesive capable of being rapidly formed at low temperature and excellent in boiling resistance and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A method for preparing a hot melt adhesive, comprising the following raw materials in molar parts:

[0029]

[0030] Further, the preparation method comprises the following steps:

[0031] A. Add the formula amount of butynediol and triethanolamine into the reaction kettle, heat up to 110°C for full melting, then add the formula amount of phthalic anhydride, adipic acid and monobutyltin oxide, / h Gradually raise the temperature to 200°C, and keep warm for reaction;

[0032] B. When the acid value of the system mixture is reduced to 58mgKOH / g, lower the temperature to 120°C, add the prescribed amount of trimethylolpropane triglycidyl ether, and continue the heat preservation reaction;

[0033] C. When the acid value of the system mixture is less than 10mgKOH / g, and the epoxy equivalent is 875g / mol, cool down to 95°C, and then add m-phenylenediamine in the formulated amount to melt and mix for 1min;

[0034] D. After mixing evenly, the material is then discharged thr...

Embodiment 2

[0037] A method for preparing a hot melt adhesive, comprising the following raw materials in molar parts:

[0038]

[0039] Further, the preparation method comprises the following steps:

[0040] A. Add the formula amount of butynediol and triethanolamine into the reaction kettle, heat up to 120°C for full melting, then add the formula amount of phthalic anhydride, adipic acid and monobutyltin oxide, / h Gradually raise the temperature to 210°C, and keep warm for reaction;

[0041] B. When the acid value of the system mixture is reduced to 51mgKOH / g, lower the temperature to 130°C, add the formulated amount of trimethylolpropane triglycidyl ether, and continue the heat preservation reaction;

[0042] C. When the acid value of the system mixture is less than 10mgKOH / g, and the epoxy equivalent is 812g / mol, the temperature is lowered to 100°C, and then the m-phenylenediamine of the formulated amount is added to melt and mix for 0.5min;

[0043] D. After mixing evenly, the ma...

Embodiment 3

[0046] A method for preparing a hot melt adhesive, comprising the following raw materials in molar parts:

[0047]

[0048] Further, the preparation method comprises the following steps:

[0049] A. Add the formula amount of butynediol and triethanolamine into the reaction kettle, heat up to 110°C for full melting, then add the formula amount of phthalic anhydride, adipic acid and monobutyltin oxide, / h Gradually raise the temperature to 205°C, and keep warm for reaction;

[0050] B. When the acid value of the system mixture is reduced to 56mgKOH / g, lower the temperature to 125°C, add the prescribed amount of trimethylolpropane triglycidyl ether, and continue the heat preservation reaction;

[0051] C. When the acid value of the system mixture is less than 10mgKOH / g, and the epoxy equivalent is 960g / mol, cool down to 98°C, and then add m-phenylenediamine in the formulated amount to melt and mix for 1min;

[0052] D. After mixing evenly, the material is then discharged thr...

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Abstract

The invention relates to a hot melt adhesive and a preparation method thereof. The hot melt adhesive comprises the following raw materials in parts by mole: 8-12 parts of phthalic anhydride; 5-10 parts of adipic acid; 7-13 parts of butynediol; 3-6 parts of triethanolamine; 5-9 parts of trimethylol propane triglycidyl ether; 1-2 parts of m-phenylene diamine; and 0.02-0.05 part of mono-butyl tin oxide. The hot melt adhesive has the advantages of low melting temperature, high curing molding speed at low temperature, excellent holding power after curing and excellent durability and boiling water boiling resistance, and can be used for bonding low-temperature materials such as cartons, wood, floors, plastic-wood composite boards and the like.

Description

technical field [0001] The invention relates to the field of hot-melt adhesives, in particular to a hot-melt adhesive for rapid prototyping at low temperature and excellent boiling resistance and a preparation method thereof. Background technique [0002] Hot melt adhesive can change its physical state with the change of temperature within a certain temperature range, and the product itself is solid, which is convenient for packaging, transportation and storage. It is solvent-free, pollution-free, non-toxic, simple production process, high added value, It is popular for its advantages of high bonding strength and fast speed. [0003] Since the current hot melt adhesive is a pure thermoplastic resin, in order to achieve its excellent bonding strength, its molecular weight needs to be prepared larger to achieve its stronger cohesion, which leads to a higher softening point and a higher sizing temperature. They are all at 160°C and above, and the cooling time after sizing is l...

Claims

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Application Information

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IPC IPC(8): C09J167/06C08G63/685C08G63/85
CPCC09J167/06C08G63/6858C08G63/85
Inventor 王永垒李海云邢楠楠柴雅倩张雅文
Owner HUANGSHAN UNIV
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