VCP black hole-copper plating integrated production equipment and VCP black hole-copper plating integrated production process for flexible circuit

Abstract

The invention relates to the technical field of circuit board manufacturing, in particular to VCP black hole-copper plating integrated production equipment and a VCP black hole-copper plating integrated production process for a flexible circuit. The production equipment comprises a cutting device, a drilling device, an electroplating device, a circuit manufacturing device, an etching device and a subsequent processing device, wherein the cutting device is used for primarily cutting a base material to obtain a base plate; the drilling device is used for conducting drilling to obtain a through hole for communicating the front surface and the back surface of the substrate; and the electroplating device comprises a black-hole forming device and a VCP copper plating device, the black-hole forming device is used for forming a conductive layer on the hole wall of the through hole, and the VCP copper plating device is used for carrying out electrocoppering treatment on the substrate through a VCP copper plating technology. According to the production equipment, a black-hole liquid chemical tank is additionally arranged at the front end of the VCP copper plating device, so a black-hole copper plating VCP production line is formed, and field and equipment investment cost is reduced; and a black-hole treatment process is integrated into the VCP copper plating process, so process steps are reduced, and manufacturing time is shortened.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a flexible circuit VCP black hole and copper-plated integrated production equipment and production process. Background technique [0002] In the double-sided flexible circuit electroplating manufacturing production equipment, the current industry practice for the production equipment of the via hole is to drill the hole and then go through the black hole treatment, and then put the flexible board material into the VCP electroplating line for copper plating. The black hole treatment is to make the fine The graphite and carbon black powder are uniformly dispersed in the medium, that is, deionized water, and the evenly distributed graphite and carbon black particles in the solution are kept stable by using the surfactant in the solution. Black can be fully adsorbed on the surface of the non-conductor hole wall to form a uniform, fine, and firmly bonded conductive...

AI Technical Summary

Problems solved by technology

[0003] The existing production equipment is usually two independent production lines of horizontal black hole production equipment and VCP electroplating equipment. Using two independent production lines occupies a lot of space and equipment investment costs, increases the product transfer process, and the process is lengthy and increases Labor costs and quality risks, and two independent production lines require independent operation and control, high water and electricity energy consumption, high cost of use, and multiple overlapping processes increase unnecessary work intensity

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