Packaging structure and method of infrared thermal pile sensor
A packaging structure and packaging method technology, which is applied in the manufacture/processing of thermoelectric devices, the use of electric/magnetic devices to transfer sensing components, thermoelectric device components, etc., can solve the problems of large volume and complex process, and achieve integrated packaging. , the effect of shortening process steps and improving reliability
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0036] In order to solve the above problems, this embodiment provides a package structure of infrared thermal pile sensors, such as figure 1 shown, including:
[0037] the first substrate 200;
[0038] A thermopile structure located on the first surface of the first substrate 200, the thermopile structure includes a thermopile body composed of at least one set of thermocouple pairs;
[0039] The cover substrate is arranged above the thermopile structure and forms a first cavity 320 with the upper surface of the thermopile structure. The film-like thermistor 310 is arranged on the cover substrate.
[0040] The cover substrate has a first surface and a second surface, the first surface is the surface where the cover substrate and the thermopile structure enclose the first cavity 320 , and the second surface is opposite to the first surface.
[0041] In this embodiment, the thermistor 310 is located on the first surface of the cover substrate; in one embodiment, the thermistor ...
Embodiment 2
[0082] This embodiment provides a method for packaging an infrared thermal pile sensor, including:
[0083] S01: providing a first substrate;
[0084] S02: forming a thermopile structure on the first surface of the first substrate, where the thermopile structure includes a thermopile body composed of at least one set of thermocouple pairs;
[0085] S03: forming a cover substrate on the upper surface of the thermopile structure, and connecting the cover substrate and the upper surface of the thermopile structure to form a first cavity;
[0086] S04: Forming a film thermistor on the cover substrate.
[0087] Step SON does not represent a sequence.
[0088] Figure 3 to Figure 11 It is a structural schematic diagram corresponding to the corresponding steps of the manufacturing method of a packaging structure of an infrared thermal pile sensor in this embodiment, refer to Figure 3 to Figure 11 , detailing the manufacturing method of the package structure of the infrared therm...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com