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Diamond particle uniform distribution device for machining diamond tool bit and abrasive block

A technology of diamond cutter head and diamond particles, which is applied in the field of diamond particle uniform arrangement device for diamond cutter head and grinding block processing, and can solve the problems of difficult processing and high processing cost of diamond cutter head

Pending Publication Date: 2021-04-20
厦门钻力科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the shortcomings in the prior art, to provide a device for evenly arranging diamond particles for diamond cutter head and grinding block processing, which solves the problems of difficult processing and high processing cost of diamond cutter head

Method used

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  • Diamond particle uniform distribution device for machining diamond tool bit and abrasive block
  • Diamond particle uniform distribution device for machining diamond tool bit and abrasive block
  • Diamond particle uniform distribution device for machining diamond tool bit and abrasive block

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0026] refer to Figure 1-3 , the device for evenly arranging diamond particles for diamond segment and grinding block processing provided in this embodiment can be applied to processing equipment such as diamond segment or grinding block or grinding disc, but not limited to one time. The uniform arrangement device of this embodiment is fixed on the frame 1 and includes front and rear telescopic cylinders 2 , lifting cylinders 3 , vibrating cylinders 4 and suction cup assemblies 5 .

[0027] Among them, the front and rear telescopic cylinders 2 are fixed on the frame 1, the lifting cylinder 3 and the vibrating cylinder 4 are fixed on the slide plate 12, the bottom si...

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Abstract

The invention discloses a diamond particle uniform distribution device for machining of a diamond tool bit and an abrasive block. The device is fixed to a rack and comprises a front-back driving device, a lifting air cylinder and a suction cup assembly, wherein the lifting air cylinder is fixed to a sliding plate, a driving device is connected with the sliding plate and drives the sliding plate to move front and back, the lifting air cylinder is connected with an upward-pressing sliding plate, and the suction cup assembly is fixed to the upward-pressing sliding plate. According to the diamond particle uniform distribution device, diamond particles which are arranged in order are uniformly adsorbed by the suction cup assembly, so that the diamond particles are quickly and orderly arranged in a blank in multiple layers; and a vibration air cylinder is additionally arranged, and in the diamond particle adsorption link, the diamond particle arrangement link and the suction cup assembly return process, the suction cup assembly can be knocked and vibrated, so that the situation that the suction cup assembly adsorbs redundant diamond particles or adheres to other metal powder is avoided, and the machining precision and the machining efficiency are improved.

Description

technical field [0001] The invention relates to the technical field of diamond cutter head and grinding block processing, in particular to a device for evenly arranging diamond particles for diamond cutter head and grinding block processing. Background technique [0002] Diamond saw blades have the advantages of firm cutting head, high precision and high stability in use, and are widely used in the processing of hard materials such as stone and ceramics. In the cutter head of the diamond saw blade, the distribution of diamond in the matrix is ​​disordered, and segregation will occur during the process of mechanical mixing. Diamonds will aggregate, the utilization rate of diamonds will be reduced during the cutting process, and the cutting resistance will be increased. [0003] The diamond orderly arrangement technology can make the diamonds evenly distributed in the carcass, and each diamond can play a role in processing, saving diamond costs, improving cutting efficiency a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/04B28D1/12
Inventor 余胜
Owner 厦门钻力科技有限公司
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